Ring Inc
Component Engineering Technical Leader – High Speed Interconnect
Ring Inc, San Jose, California, United States, 95199
Component Engineering Technical Leader
High Speed Interconnect
Location:
San Jose, CA (Hybrid: 4+ days/week onsite)
Compensation:
$168K
$241K base + bonus + potential equity
Employment Type:
Full-time, Direct Hire
Industry:
Networking Hardware / Systems / Electronics
Confidential Client:
Leading global technology company Overview
A global technology innovator is seeking a
Component Engineering Technical Leader
to drive failure analysis and root cause investigations for high-speed interconnect components used in advanced networking systems. This is a
high-impact, cross-functional role
ideal for a hands-on engineer who thrives in fast-paced, escalated situations and has deep interconnect and FA expertise.
You'll act as the technical lead for
field, NPI, and reliability failure investigations , collaborating closely with design teams, global suppliers, and manufacturing partners. Your findings will directly influence product improvements, vendor accountability, and long-term reliability standards. Key Responsibilities
Lead full-cycle
failure analysis
of interconnect components (e.g., connectors, backplanes, cables)
Develop and execute
non-destructive and destructive
test strategies
Collaborate with vendors and internal labs to
identify root causes
and corrective actions
Present findings to senior stakeholders and drive cross-functional resolution
Improve FA methodologies and contribute to continuous process refinement Required Qualifications
10+ years
of experience in hardware engineering, failure analysis, or component engineering
Deep knowledge of
high-speed interconnects , materials, and manufacturing processes
Proficient in FA techniques and tools: X-ray, SEM, cross-sectioning, FMEA, 8D, DOE
Experience managing
supplier investigations
and holding vendors accountable
Strong communication skills and experience presenting to executive leadership Preferred Experience
Background in networking hardware or data center systems
Experience with PCB/PCBA assembly and signal integrity challenges
Prior work with major interconnect vendors (e.g., Molex, Amphenol, TE)
Exposure to customer-facing escalations or field failure management Work Environment & Benefits
Hybrid schedule:
Onsite in San Jose 4+ days/week (not remote)
Relocation assistance:
May be available for qualified candidates
Competitive base salary, annual bonus, and potential equity
Full medical/dental/vision, 401(k) match, paid sick leave, and volunteer time
Join a global engineering team solving some of the most complex system reliability challenges in the industry $160,000 - $240,000 a year
Compensation details:
160000-240000 Yearly Salary
PI5218656b4be6-37528-38421625
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High Speed Interconnect
Location:
San Jose, CA (Hybrid: 4+ days/week onsite)
Compensation:
$168K
$241K base + bonus + potential equity
Employment Type:
Full-time, Direct Hire
Industry:
Networking Hardware / Systems / Electronics
Confidential Client:
Leading global technology company Overview
A global technology innovator is seeking a
Component Engineering Technical Leader
to drive failure analysis and root cause investigations for high-speed interconnect components used in advanced networking systems. This is a
high-impact, cross-functional role
ideal for a hands-on engineer who thrives in fast-paced, escalated situations and has deep interconnect and FA expertise.
You'll act as the technical lead for
field, NPI, and reliability failure investigations , collaborating closely with design teams, global suppliers, and manufacturing partners. Your findings will directly influence product improvements, vendor accountability, and long-term reliability standards. Key Responsibilities
Lead full-cycle
failure analysis
of interconnect components (e.g., connectors, backplanes, cables)
Develop and execute
non-destructive and destructive
test strategies
Collaborate with vendors and internal labs to
identify root causes
and corrective actions
Present findings to senior stakeholders and drive cross-functional resolution
Improve FA methodologies and contribute to continuous process refinement Required Qualifications
10+ years
of experience in hardware engineering, failure analysis, or component engineering
Deep knowledge of
high-speed interconnects , materials, and manufacturing processes
Proficient in FA techniques and tools: X-ray, SEM, cross-sectioning, FMEA, 8D, DOE
Experience managing
supplier investigations
and holding vendors accountable
Strong communication skills and experience presenting to executive leadership Preferred Experience
Background in networking hardware or data center systems
Experience with PCB/PCBA assembly and signal integrity challenges
Prior work with major interconnect vendors (e.g., Molex, Amphenol, TE)
Exposure to customer-facing escalations or field failure management Work Environment & Benefits
Hybrid schedule:
Onsite in San Jose 4+ days/week (not remote)
Relocation assistance:
May be available for qualified candidates
Competitive base salary, annual bonus, and potential equity
Full medical/dental/vision, 401(k) match, paid sick leave, and volunteer time
Join a global engineering team solving some of the most complex system reliability challenges in the industry $160,000 - $240,000 a year
Compensation details:
160000-240000 Yearly Salary
PI5218656b4be6-37528-38421625
#J-18808-Ljbffr