Johns Hopkins University
Associate Research Scientist (PREP0003538)
Johns Hopkins University, Baltimore, Maryland, United States, 21276
Overview
PREP Research Associate CHIPS Funded Project This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. NIST recognizes that its research staff may wish to collaborate with researchers at academic institutions on specific projects of mutual interest, and thus requires that such institutions be the recipient of a PREP award. The PREP program requires staff from a wide range of backgrounds to work on scientific research in many areas. Employees in this position will perform technical work that underpins the scientific research of the collaboration. Research Title:
Reliability Testing and Failure Analysis for Advanced Packaging of CHIPS The work will entail:
The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a researcher with knowledge of reliability testing and modeling for advanced semiconductor packaging and extensive expertise in one or more of the following technical areas: polymer degradation, thermal and mechanical analysis, failure analysis using microscopy, spectroscopy, or scattering based techniques, accelerated laboratory testing and thin film characterization. If selected, you will play a significant role in the projects related to reliability testing and modeling for advanced packaging in semiconductors. This includes working with NIST staff and external partners on planning and executing experimental research to evaluate changes in mechanical, thermal, and electrical properties of polymeric materials used in advanced packaging in CHIPS after aging under environmental stresses. The results will be used to understand the failure mechanism, develop more accurate prediction models for long-term reliability of advanced packaging reliability and provide a scientific basis for test method development, material selection, and product quality assurance for the semiconductor industry. Key responsibilities will include but are not limited to: Characterizing the degradation of materials and interfaces before, during, and after exposure to accelerated laboratory aging. Developing thermal conductivity/thermal resistance and specific thermal analyzers for samples used in CHIPS advanced packaging. Conducting in-situ mechanical property (elastic modulus, storage modulus, material creep, relaxation, adhesion) measurements at different temperatures. Developing test protocol for X-ray computed tomography for analysis of packaged samples before and after multi-stress testing. Developing microscopic and spectroscopic analytical methods for complex advanced packaging systems. Developing robust datasets of materials and interface properties before and after aging for reliability models. Disseminating research results through presentations at conferences, publication of journal papers, and technical reports. Qualifications
U.S. Citizen Ph.D. in Materials Science / Mechanical Engineering / Electrical Engineering / Physics / Chemical Engineering / Chemistry Strong oral and written communication skills Experience in: X-ray scattering or computed tomography Nano- and micro-scale materials characterization Degradation or failure analysis of polymeric materials Experience in advanced semiconductor packaging is preferred Application Instructions
Please upload the following with your application: CV/Resume Please limit C.V to 3 pages only and ONLY include a valid email address for your contact info. Please DO NOT include telephone numbers, home address or photos on your resume. Privacy and Compliance
Privacy Act Statement Authority:
15 U.S.C. § 278g-1(e)(1) and (e)(3) and 15 U.S.C. § 272(b) and (c) Purpose:
The National Institute for Standards and Technology (NIST) hosts the PREP which is designed to provide valuable laboratory experience and financial assistance to undergraduates, post-bachelor's degree holders, graduate students, master's degree holders, postdocs, and faculty. Routine Uses:
NIST will use the information collected to perform the requisite reviews of the applications to determine eligibility, and to meet programmatic requirements. Disclosure of this information is also subject to published routine uses as identified in the Privacy Act System of Records Notices: NIST-1: NIST Associates. Disclosure:
Furnishing this information is voluntary. By applying to a CHIPS-funded PREP opportunity, you acknowledge that participation in the project requires signing a Non-Disclosure Agreement (NDA) prior to beginning any work. To apply for this position, visit:
apply interfolio placeholder text Salary Range The referenced salary range represents the minimum and maximum salaries for this position and is based on Johns Hopkins University's good faith belief at the time of posting. Not all candidates will be eligible for the upper end of the salary range. The actual compensation offered to the selected candidate may vary and will depend on multiple factors including location, skills, experience, internal equity, market conditions, education/training and other factors, as reasonably determined by the University. Total Rewards Johns Hopkins offers a total rewards package that supports employees' health, life, career and retirement. More information can be found here: Hopkins benefits page (text only). Equal Opportunity Employer The Johns Hopkins University is committed to equal opportunity for its faculty, staff, and students and does not discriminate on the basis of sex, gender, marital status, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status or other legally protected characteristics. Pre-Employment Information If you require special assistance or accommodation during any part of the pre-employment process, please contact the HR Business Services Office. For more information about workplace accommodations visit accessibility information. Background Checks Selected candidates will be subject to a pre-employment background check including education verification. EEO and Diversity The Johns Hopkins University values diversity, equity and inclusion and advances these through our Roadmap on Diversity and Inclusion. Vaccine Requirements Vaccination requirements vary by campus. The School of Medicine requires full FDA COVID-19 vaccination; other campuses may have different policies. See campus-specific guidance for details.
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PREP Research Associate CHIPS Funded Project This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. NIST recognizes that its research staff may wish to collaborate with researchers at academic institutions on specific projects of mutual interest, and thus requires that such institutions be the recipient of a PREP award. The PREP program requires staff from a wide range of backgrounds to work on scientific research in many areas. Employees in this position will perform technical work that underpins the scientific research of the collaboration. Research Title:
Reliability Testing and Failure Analysis for Advanced Packaging of CHIPS The work will entail:
The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a researcher with knowledge of reliability testing and modeling for advanced semiconductor packaging and extensive expertise in one or more of the following technical areas: polymer degradation, thermal and mechanical analysis, failure analysis using microscopy, spectroscopy, or scattering based techniques, accelerated laboratory testing and thin film characterization. If selected, you will play a significant role in the projects related to reliability testing and modeling for advanced packaging in semiconductors. This includes working with NIST staff and external partners on planning and executing experimental research to evaluate changes in mechanical, thermal, and electrical properties of polymeric materials used in advanced packaging in CHIPS after aging under environmental stresses. The results will be used to understand the failure mechanism, develop more accurate prediction models for long-term reliability of advanced packaging reliability and provide a scientific basis for test method development, material selection, and product quality assurance for the semiconductor industry. Key responsibilities will include but are not limited to: Characterizing the degradation of materials and interfaces before, during, and after exposure to accelerated laboratory aging. Developing thermal conductivity/thermal resistance and specific thermal analyzers for samples used in CHIPS advanced packaging. Conducting in-situ mechanical property (elastic modulus, storage modulus, material creep, relaxation, adhesion) measurements at different temperatures. Developing test protocol for X-ray computed tomography for analysis of packaged samples before and after multi-stress testing. Developing microscopic and spectroscopic analytical methods for complex advanced packaging systems. Developing robust datasets of materials and interface properties before and after aging for reliability models. Disseminating research results through presentations at conferences, publication of journal papers, and technical reports. Qualifications
U.S. Citizen Ph.D. in Materials Science / Mechanical Engineering / Electrical Engineering / Physics / Chemical Engineering / Chemistry Strong oral and written communication skills Experience in: X-ray scattering or computed tomography Nano- and micro-scale materials characterization Degradation or failure analysis of polymeric materials Experience in advanced semiconductor packaging is preferred Application Instructions
Please upload the following with your application: CV/Resume Please limit C.V to 3 pages only and ONLY include a valid email address for your contact info. Please DO NOT include telephone numbers, home address or photos on your resume. Privacy and Compliance
Privacy Act Statement Authority:
15 U.S.C. § 278g-1(e)(1) and (e)(3) and 15 U.S.C. § 272(b) and (c) Purpose:
The National Institute for Standards and Technology (NIST) hosts the PREP which is designed to provide valuable laboratory experience and financial assistance to undergraduates, post-bachelor's degree holders, graduate students, master's degree holders, postdocs, and faculty. Routine Uses:
NIST will use the information collected to perform the requisite reviews of the applications to determine eligibility, and to meet programmatic requirements. Disclosure of this information is also subject to published routine uses as identified in the Privacy Act System of Records Notices: NIST-1: NIST Associates. Disclosure:
Furnishing this information is voluntary. By applying to a CHIPS-funded PREP opportunity, you acknowledge that participation in the project requires signing a Non-Disclosure Agreement (NDA) prior to beginning any work. To apply for this position, visit:
apply interfolio placeholder text Salary Range The referenced salary range represents the minimum and maximum salaries for this position and is based on Johns Hopkins University's good faith belief at the time of posting. Not all candidates will be eligible for the upper end of the salary range. The actual compensation offered to the selected candidate may vary and will depend on multiple factors including location, skills, experience, internal equity, market conditions, education/training and other factors, as reasonably determined by the University. Total Rewards Johns Hopkins offers a total rewards package that supports employees' health, life, career and retirement. More information can be found here: Hopkins benefits page (text only). Equal Opportunity Employer The Johns Hopkins University is committed to equal opportunity for its faculty, staff, and students and does not discriminate on the basis of sex, gender, marital status, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status or other legally protected characteristics. Pre-Employment Information If you require special assistance or accommodation during any part of the pre-employment process, please contact the HR Business Services Office. For more information about workplace accommodations visit accessibility information. Background Checks Selected candidates will be subject to a pre-employment background check including education verification. EEO and Diversity The Johns Hopkins University values diversity, equity and inclusion and advances these through our Roadmap on Diversity and Inclusion. Vaccine Requirements Vaccination requirements vary by campus. The School of Medicine requires full FDA COVID-19 vaccination; other campuses may have different policies. See campus-specific guidance for details.
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