High Voltage Packaging Engineering Manager

Change the world. Love your job. Texas Instruments is seeking a High Voltage Packaging Engineering Manager. In this role, you will direct development of new package/container requirements and oversee the quality of existing packages/containers for all product groups. You may also develop designs to meet requirements needed for the nature of the product, transportation methods, cost considerations, legal requirements, and package content characteristics. You will consider the need for resistance to external variables such as temperature variations, light, moisture, and corrosive chemicals. You may oversee the coordination of activities at contract packaging and labeling sites. An additional job function includes overseeing exterior package design to ensure proper product identification, consumer appeal, printing appearance, and production techniques. The role requires current knowledge of hazards and safety protocols for safe handling, transportation, and use of products. As a High Voltage Packaging Engineering Manager, you may also select, develop and evaluate personnel to ensure the efficient operation of the function. Responsibilities of the team may include: Define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets Understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps Define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools Develop new process flows/technologies necessary to create 1 st

article prototype and also scale to high volume manufacturing Outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues Build upon current knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps Work collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products

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