Oracle
Overview
As a Senior Principal Thermal Engineer, you will focus on the alignment of OCI thermal hardware design with specific experience in Rack Cooling and the data center physical infrastructure. A mix of technical breadth and depth is required to work cross-functionally with different disciplines (Mechanical, Electrical, Thermal, and Software) to develop and set cooling strategies and actual HW setup that are optimized for the entire rack and effectively manage high performance data center infrastructure. You will work with internal and external partners, focusing on delivering the next generation of world class fluid-cooled hardware and data centers. Responsibilities
Build, conduct thermal simulations, and review thermal simulation models from partners to identify data center risks and improve efficiency. Familiarization with Open Compute Design Specifications. Familiarization with Next Generation Fluid Cooling Solutions and Advanced Thermal Designs. Understanding mechanical design process to work with mechanical design engineers on all engineering development efforts Experience with mechanical validation tests process that may include, Environmental Test Engineering (ETE), Vibration testing & characterization. Familiarity with Electromagnetic Compliance (EMI/EMC) is a plus Experience in negotiating, establishing, and managing relationships with vendors Additional context:
The role involves collaborating with internal and external partners across the globe to develop platform hardware and data center infrastructure solutions enabling OCI services. Lead thermal design reviews and presentations to peers, partner teams, and executives. Proficiency with thermal modeling tools at component, server, rack, and data center levels. Engineering analysis of fluid cooling assembly and fit-up engineering verification of various GPU and switch configurations in respective racks. Experience with sourcing and selection of in-row and in-rack CDU’s for high end / high reliability compute solutions. Lead liquid cooling server/ rack designs to support engineering lab and manufacturing tests. Stay informed about the latest fluid cooling industry roadmap and key technology suppliers and understand driving factors for deploying different fluid cooling technologies. Design and deliver direct to chip liquid cooling loops including internal manifolds, cold plates, hoses, and QD’s for high end, high reliability compute systems. Establish relationships with outside suppliers to develop high quality components and manage vendor selection. Oversee build and validation test process of prototypes. Perform root cause and corrective action analysis as required. Interface with internal and external customers to meet product design intent. Familiar with fluid cooling end assembly (L10/L11) manufacturing challenges and long-term reliability concerns. Work with multidisciplinary teams to develop Advanced Cooling Solution (ACS) concept prototypes and drive concepts to OCI data center fleet. Collaborate with firmware and controls engineering teams to create robust thermal control and monitoring systems. Conduct design/debug investigations and support failure analysis and resolution activities for platforms and data center infrastructure. Create and execute thermal characterization test plans; collaborate with technicians and industry partners to complete tests and analyze results to validate against specifications. Create robust, scalable, secure, and extensible thermal architecture solutions aligned with current and anticipated industry needs. Distill and articulate architectural tradeoffs in terms of feasibility, performance, cost, reliability, availability, and schedule. Partner with platform and data center architects to drive OCI roadmap definitions. Look for opportunities to generate intellectual property to strengthen OCI’s leadership in cloud computing. Drive and influence technology providers and design partners to develop optimal components and solutions for future OCI fleet requirements. Collaborate with industry standards bodies to shape next-generation form factors. Coordinate with hardware development and data center design/construction teams for seamless transition from architecture to implementation. Collaborate with multifunctional engineering groups to deliver hardware and data center sites aligned with thermal specifications. Collaborate with firmware and controls teams to create robust thermal control and monitoring systems. Design and create thermal characterization test plans. Collaborate with technicians and industry partners to complete tests and analyze results to validate compliance with platform and data center infrastructure specifications. Support high-level thermal design direction and data center strategy for complex systems (HPC, GPU, FPGA accelerators, etc.) to general compute, storage, network and other programs. Minimum Qualifications
10+ years cloud scale provider OR related technical engineering experience AND a Bachelor’s Degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering. OR 7+ years related cloud scale provider OR technical engineering experience AND Master’s Degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering. OR 5+ years related cloud scale provider OR technical engineering experience AND Doctorate degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering. Experience and proficiency in Computational Fluid Dynamics (CFD) analysis and Model Based Design (MBD) analysis. Expertise using Cadence Data Center Solution (aka 6SigmaDCX), OR CoolSim, OR TileFlow, OR AutoDesk CFD, OR ANSYS - Icepak, OR Mentor Graphics FloTHERM. Expertise using MATLAB & Simulink, OpenModelica, Dymola About Us and Compliance
Certain US customer or client-facing roles may be required to comply with applicable requirements, such as immunization and occupational health mandates. Range and benefit information provided in this posting are specific to the stated locations only. US: Hiring Range in USD from: $120,100 - $251,600 per year. May be eligible for bonus, equity, and compensation deferral. Oracle maintains broad salary ranges for its roles in order to account for variations in knowledge, skills, experience, market conditions and locations, as well as reflect Oracle’s differing products, industries and lines of business. Oracle is an Equal Employment Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability and protected veterans’ status, or any other characteristic protected by law. Oracle will consider for employment qualified applicants with arrest and conviction records pursuant to applicable law. If you require accessibility assistance or accommodation, please email accommodation-request_mb@oracle.com or call +1 888 404 2494 in the United States.
#J-18808-Ljbffr
As a Senior Principal Thermal Engineer, you will focus on the alignment of OCI thermal hardware design with specific experience in Rack Cooling and the data center physical infrastructure. A mix of technical breadth and depth is required to work cross-functionally with different disciplines (Mechanical, Electrical, Thermal, and Software) to develop and set cooling strategies and actual HW setup that are optimized for the entire rack and effectively manage high performance data center infrastructure. You will work with internal and external partners, focusing on delivering the next generation of world class fluid-cooled hardware and data centers. Responsibilities
Build, conduct thermal simulations, and review thermal simulation models from partners to identify data center risks and improve efficiency. Familiarization with Open Compute Design Specifications. Familiarization with Next Generation Fluid Cooling Solutions and Advanced Thermal Designs. Understanding mechanical design process to work with mechanical design engineers on all engineering development efforts Experience with mechanical validation tests process that may include, Environmental Test Engineering (ETE), Vibration testing & characterization. Familiarity with Electromagnetic Compliance (EMI/EMC) is a plus Experience in negotiating, establishing, and managing relationships with vendors Additional context:
The role involves collaborating with internal and external partners across the globe to develop platform hardware and data center infrastructure solutions enabling OCI services. Lead thermal design reviews and presentations to peers, partner teams, and executives. Proficiency with thermal modeling tools at component, server, rack, and data center levels. Engineering analysis of fluid cooling assembly and fit-up engineering verification of various GPU and switch configurations in respective racks. Experience with sourcing and selection of in-row and in-rack CDU’s for high end / high reliability compute solutions. Lead liquid cooling server/ rack designs to support engineering lab and manufacturing tests. Stay informed about the latest fluid cooling industry roadmap and key technology suppliers and understand driving factors for deploying different fluid cooling technologies. Design and deliver direct to chip liquid cooling loops including internal manifolds, cold plates, hoses, and QD’s for high end, high reliability compute systems. Establish relationships with outside suppliers to develop high quality components and manage vendor selection. Oversee build and validation test process of prototypes. Perform root cause and corrective action analysis as required. Interface with internal and external customers to meet product design intent. Familiar with fluid cooling end assembly (L10/L11) manufacturing challenges and long-term reliability concerns. Work with multidisciplinary teams to develop Advanced Cooling Solution (ACS) concept prototypes and drive concepts to OCI data center fleet. Collaborate with firmware and controls engineering teams to create robust thermal control and monitoring systems. Conduct design/debug investigations and support failure analysis and resolution activities for platforms and data center infrastructure. Create and execute thermal characterization test plans; collaborate with technicians and industry partners to complete tests and analyze results to validate against specifications. Create robust, scalable, secure, and extensible thermal architecture solutions aligned with current and anticipated industry needs. Distill and articulate architectural tradeoffs in terms of feasibility, performance, cost, reliability, availability, and schedule. Partner with platform and data center architects to drive OCI roadmap definitions. Look for opportunities to generate intellectual property to strengthen OCI’s leadership in cloud computing. Drive and influence technology providers and design partners to develop optimal components and solutions for future OCI fleet requirements. Collaborate with industry standards bodies to shape next-generation form factors. Coordinate with hardware development and data center design/construction teams for seamless transition from architecture to implementation. Collaborate with multifunctional engineering groups to deliver hardware and data center sites aligned with thermal specifications. Collaborate with firmware and controls teams to create robust thermal control and monitoring systems. Design and create thermal characterization test plans. Collaborate with technicians and industry partners to complete tests and analyze results to validate compliance with platform and data center infrastructure specifications. Support high-level thermal design direction and data center strategy for complex systems (HPC, GPU, FPGA accelerators, etc.) to general compute, storage, network and other programs. Minimum Qualifications
10+ years cloud scale provider OR related technical engineering experience AND a Bachelor’s Degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering. OR 7+ years related cloud scale provider OR technical engineering experience AND Master’s Degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering. OR 5+ years related cloud scale provider OR technical engineering experience AND Doctorate degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering. Experience and proficiency in Computational Fluid Dynamics (CFD) analysis and Model Based Design (MBD) analysis. Expertise using Cadence Data Center Solution (aka 6SigmaDCX), OR CoolSim, OR TileFlow, OR AutoDesk CFD, OR ANSYS - Icepak, OR Mentor Graphics FloTHERM. Expertise using MATLAB & Simulink, OpenModelica, Dymola About Us and Compliance
Certain US customer or client-facing roles may be required to comply with applicable requirements, such as immunization and occupational health mandates. Range and benefit information provided in this posting are specific to the stated locations only. US: Hiring Range in USD from: $120,100 - $251,600 per year. May be eligible for bonus, equity, and compensation deferral. Oracle maintains broad salary ranges for its roles in order to account for variations in knowledge, skills, experience, market conditions and locations, as well as reflect Oracle’s differing products, industries and lines of business. Oracle is an Equal Employment Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability and protected veterans’ status, or any other characteristic protected by law. Oracle will consider for employment qualified applicants with arrest and conviction records pursuant to applicable law. If you require accessibility assistance or accommodation, please email accommodation-request_mb@oracle.com or call +1 888 404 2494 in the United States.
#J-18808-Ljbffr