Micron Technology, Inc.
Principal Process Engineer, Die Bonding
Micron Technology, Inc., Boise, Idaho, United States, 83708
Overview
Micron Technology is a world leader in memory and storage solutions, driving the AI revolution through innovative processes and technologies. The Advanced Packaging Technology Development (APTD) department leads innovations in memory and storage interconnects and packaging solutions, collaborating with global R&D, equipment and materials suppliers, and manufacturing teams to develop, transfer, and implement new technology nodes while maintaining Micron's leadership. Role
Principal Process Engineer in Die Bonding. You will start up, develop, and optimize processes to improve product quality and reliability, work on process yield improvement, cost reduction, productivity improvement, and risk management, and resolve manufacturing line problems. You will identify, diagnose, and resolve assembly process related problems using failure analysis, FMEA, 8D or SPC/FDC methodologies. Responsibilities
Develop, diagnose, and resolve die bonding process technologies Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process steps Lead and participate in continuous yield improvement and cost reduction activities Validate and fan out new process baselines qualified, including new process, tools, and/or materials for new product introduction Manage, audit, and liaise with material suppliers to achieve quality, cost, and risk management objectives Support SPC/FDC/RMS/APC and site-to-site portability Support internal and external audits Minimum Qualifications
A BS degree with minimum 8+ years of proven experience in Semiconductor Process Engineering Solid engineering knowledge of semiconductor advanced packaging die stacking processes Skilled at designing valid tests and Design of Experiments (DOE) Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs Excellent oral and written communication skills and a strong attention to detail Highly self-motivated with the ability to work independently, as a group leader, and as a collaborative contributor Knowledge and understanding of project management Preferred Qualifications
Masters or Doctorate degree in Engineering, Physics, or related field Experience in Die Bonding: Fusion Bonding, Hybrid Bonding, Direct Bonding, or applications such as MEMS, Imager, Memory or Heterogeneous Integration Bonding experience at a vendor, research institute, or semiconductor industry equipment supplier or integrator Benefits and Equal Opportunity
Micron is committed to personal wellbeing and professional growth. Benefits include medical, dental, and vision plans, paid time off, paid holidays, and programs to protect income during illness or injury. For more information, see the Benefits Guide on micron.com/careers/benefits. Micron is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other status protected by applicable laws. Right to work information is available from official government sources. For more details about Micron, visit micron.com/careers. For US sites: To request assistance with the application process or for reasonable accommodations, contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (option #3). Micron prohibits the use of child labor and complies with all applicable laws and standards. Micron does not charge candidates any recruitment fees or unlawfully collect any payment for employment. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. Ensure all information reflects true skills and experiences. Misuse of AI to fabricate qualifications will result in disqualification. Fraud alert: Be cautious of unsolicited offers and verify communications via the official Micron careers website.
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Micron Technology is a world leader in memory and storage solutions, driving the AI revolution through innovative processes and technologies. The Advanced Packaging Technology Development (APTD) department leads innovations in memory and storage interconnects and packaging solutions, collaborating with global R&D, equipment and materials suppliers, and manufacturing teams to develop, transfer, and implement new technology nodes while maintaining Micron's leadership. Role
Principal Process Engineer in Die Bonding. You will start up, develop, and optimize processes to improve product quality and reliability, work on process yield improvement, cost reduction, productivity improvement, and risk management, and resolve manufacturing line problems. You will identify, diagnose, and resolve assembly process related problems using failure analysis, FMEA, 8D or SPC/FDC methodologies. Responsibilities
Develop, diagnose, and resolve die bonding process technologies Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process steps Lead and participate in continuous yield improvement and cost reduction activities Validate and fan out new process baselines qualified, including new process, tools, and/or materials for new product introduction Manage, audit, and liaise with material suppliers to achieve quality, cost, and risk management objectives Support SPC/FDC/RMS/APC and site-to-site portability Support internal and external audits Minimum Qualifications
A BS degree with minimum 8+ years of proven experience in Semiconductor Process Engineering Solid engineering knowledge of semiconductor advanced packaging die stacking processes Skilled at designing valid tests and Design of Experiments (DOE) Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs Excellent oral and written communication skills and a strong attention to detail Highly self-motivated with the ability to work independently, as a group leader, and as a collaborative contributor Knowledge and understanding of project management Preferred Qualifications
Masters or Doctorate degree in Engineering, Physics, or related field Experience in Die Bonding: Fusion Bonding, Hybrid Bonding, Direct Bonding, or applications such as MEMS, Imager, Memory or Heterogeneous Integration Bonding experience at a vendor, research institute, or semiconductor industry equipment supplier or integrator Benefits and Equal Opportunity
Micron is committed to personal wellbeing and professional growth. Benefits include medical, dental, and vision plans, paid time off, paid holidays, and programs to protect income during illness or injury. For more information, see the Benefits Guide on micron.com/careers/benefits. Micron is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other status protected by applicable laws. Right to work information is available from official government sources. For more details about Micron, visit micron.com/careers. For US sites: To request assistance with the application process or for reasonable accommodations, contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (option #3). Micron prohibits the use of child labor and complies with all applicable laws and standards. Micron does not charge candidates any recruitment fees or unlawfully collect any payment for employment. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. Ensure all information reflects true skills and experiences. Misuse of AI to fabricate qualifications will result in disqualification. Fraud alert: Be cautious of unsolicited offers and verify communications via the official Micron careers website.
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