Field Application Engineer, Senior

MNC manufacturer of specialty engineering adhesive material for semiconductor industry Location: Pioneer Crescent Field application and technical support in the semiconductor assembly process Collect technical data from equipment for lab analysis and propose solutions to improvement assembly materials Provide technical consultation to customers with respect to product material application in the eqiupment processes On site customer support from product, process flow, equipment and process windows Job Requirement: Bachelor’s Degree in Material / Chemistry Engineering 5 to 8 years of experience in die-attach assembly process or surface mount technology processes Familiar with solder paste, fluxes and sintering materials Process Engineering candidates with strong knowledge in die attach process / assembly semiconductor processes are welcomed to apply Knowledge on use of software like MS Office, Minitab or JMP, AutoCAD Strong skill sets in operating all SMT machine, Lab equipment, Technical Problem Solving, Design of Experiments (DOE), FA & CSAM Opportunity to travel APAC region up to 50% to 70%

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