Power Device Engineer

Responsibilities include: Take responsibility for half-bridge power module design, based on SiC MOSFET/Si IGBT Responsible for new product bare die selection, material selection, sub-parts design and incoming inspection specification Power module function testing, reliability validation, trouble shooting and failure analysis. Take responsibility for new manufacturing process application like Sintering, informs soldering, epoxy molding compound. TFC/TR with supplier about technical issue Support inverter team for power module application Tech interface between SGP, Kokomo and China Viper Team Other tasks arranged by manager We are an equal opportunities employer and welcome applications from all qualified candidates.

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