BAE Systems Plc is hiring: Senior Principal Hardware Engineer in Merrimack
BAE Systems Plc, Merrimack, NH, US
Job Description Job Description: BAE Systems - Continued Engineering Support (Sustainment) is seeking a Lead Electrical Engineer to define the next Generation of Test Stands for the continued support of the F22 Program. The individual selected for this position will be a proven leader with diverse technical capabilities and demonstrated "hands-on" electrical engineering expertise. The individual will lead the hardware design, software development, integration/test, and delivery to the F22 factory of "NEW" test stations for all of the F22 products supported by BAE Systems. These stations will include Digital Modules, Analog Modules, RF Modules, and Power Supplies. The individual must be a self-starter with development experience working with integrated military avionics/electronic hardware and supporting test equipment. The selected electrical engineer is expected to have applicable experience in the following areas: Test Stands: Selecting the appropriate test equipment to effectively test the target hardware, considering existing hardware specifications, hardware test requirements, and cost. The candidate should have extensive experience with all types of test equipment for Digital, Analog, RF and Power Supply testing. This should include but not be limited to Power Supplies, Oscilloscopes, Power Meters, Chillers, Signal/Function Generators, Spectrum/Network Analyzers, Logic Analyzers, and Pattern Generators. Familiarity with all the typical equipment interfaces, USB, GPIB, Ethernet, PXI, PXIe, Serial RS232/RS422. Hardware Design: Design of backplane printed wiring boards and ITA. These become the interface between the test equipment and the test target. These will include providing all the necessary power to the target, signal translation between logic families (TTL/LVTTL/PECL/ECL/etc). The Backplane will also accommodate for all control interfaces, serial, JTAG, SPI, clocking and custom digital bus interfaces. These test interfaces will be designed using the Cadence Allegro and/or Altium Designer schematic capture and PWB layout tools. The designer will utilize and implement best practices during PCB design such as EMI mitigation for conducted and radiated emissions, grounding, trace impedance, length matching, power planes, stack-ups, thermal conductivity, signal integrity etc. The test backplanes can also include:
- RF circuits: LNA's, Mixers, Filters, switches etc.
- Power/Analog: Filters, Power Supplies with topologies such as Buck-Boost, amplifiers, sequencing, high-side switching, etc.
- Serial Communications such as 1553, RS485, and RS232.
- Processor interfacing, Memory such as on-board Flash and SDRAM, interfacing different buses with attention to timing and config setup, etc.