Boeing
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer
Boeing, El Segundo, California, United States, 90245
Overview
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate, Mid-Level or Senior) at Boeing. The role is part of the Space Electronics Packaging and Product Design Team located in El Segundo, CA. The ideal candidate will be highly proficient in top‑down assembly modeling, skeleton modeling and intent capture, applying GD&T correctly and comprehensively, and performing DFMAT (Design for Manufacturing, Assembly & Test) to close the loop between design and production. This role will drive complex assemblies from concept through production release, mentor junior designers, and collaborate cross‑functionally with manufacturing, tooling, electrical and quality teams. We offer an opportunity to work on full cradle‑to‑grave in‑house projects, covering mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis, with exposure to multichip modules, microelectronics, electronic systems, and satellite missions. You will be near a satellite factory enabling collaboration with satellite engineers to ensure electronics packaging solutions meet the demanding space environment. Develop your technical competence and leadership skills in a company with strong potential for long‑term career growth. Position Responsibilities
Coordinate with multi‑discipline groups to understand requirements and develop high‑level and detailed designs consistent with those requirements. Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements. Perform detailed structural and thermal analysis using hand calculations and analysis tools. Document structural analyses and data to show compliance with Boeing, customer and regulatory requirements at module, slice, and unit levels. Collaborate with Electrical Engineering to perform sizing and placement studies, and layout and route PCBs. Validate designs through reviews, testing and analysis. Develop, deploy and support new processes and process improvements to enable efficient engineering tasks, reduce cycle time and drive product improvements. Conduct Root Cause and Corrective Action to investigate failures and define go‑forward plans. Identify, track and report technical performance measures to ensure compliance with requirements. Support Supplier Management with make/buy recommendations and other technical services of limited scope. Investigate emerging technologies to develop concepts for future product designs to meet projected requirements. Work under general direction. Basic Qualifications (Required Skills/Experience)
Bachelor of Science degree in engineering, engineering technology, chemistry, physics, mathematics, data science, or computer science from an accredited program. Ability to obtain a U.S. Security Clearance (U.S. Citizenship required). Experience using Computer-Aided Design (CAD) tools. Experience with DFMAT (Design for Manufacturing, Assembly & Test). Experience with thermal, structural, dynamics, and/or vibration analysis and tools – OR experience with PCB design or assembly. Preferred Qualifications (Desired Skills/Experience)
3+ years of related work experience or an equivalent combination of education and experience 5+ years of related work experience or an equivalent combination of education and experience Experience with electronic packaging design and/or analysis Experience within aerospace or space electronics industry Experience with ANSYS, Creo, SolidWorks, FEA, Siemens NX Nastran, MSC Patran, COMSOL Excellent oral and written communication skills across disciplines Ability to collect, organize, synthesize and analyze data; summarize findings and develop recommendations Experience leading teams on complex projects Other job details
Drug Free Workplace: Boeing requires post‑offer applicants and employees to comply with drug testing policies. Pay & Benefits: Boeing offers a Total Rewards package including base pay, variable compensation, and benefits such as health insurance, retirement plans, and paid time off. Pay ranges vary by level and location. Summary pay ranges (illustrative): Associate: 85,850 – 116,150; Mid‑Level: 104,550 – 141,450; Senior: 126,650 – 171,350. Applications accepted until Oct. 24, 2025. Export Control: This position must meet export control compliance requirements. U.S. Person status may be required. Education: Bachelor’s Degree or equivalent required. Relocation: This position offers relocation assistance based on eligibility. Security Clearance: Ability to obtain a U.S. Security Clearance; Interim/Final Top Secret/SCI may be required post‑start. Visa Sponsorship: Boeing will not sponsor applicants for employment visa status. Shift: This position is for 1st shift. Equal Opportunity Employer: Boeing does not discriminate based on race, color, religion, national origin, gender, sexual orientation, gender identity, age, disability, or protected characteristics.
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Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate, Mid-Level or Senior) at Boeing. The role is part of the Space Electronics Packaging and Product Design Team located in El Segundo, CA. The ideal candidate will be highly proficient in top‑down assembly modeling, skeleton modeling and intent capture, applying GD&T correctly and comprehensively, and performing DFMAT (Design for Manufacturing, Assembly & Test) to close the loop between design and production. This role will drive complex assemblies from concept through production release, mentor junior designers, and collaborate cross‑functionally with manufacturing, tooling, electrical and quality teams. We offer an opportunity to work on full cradle‑to‑grave in‑house projects, covering mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis, with exposure to multichip modules, microelectronics, electronic systems, and satellite missions. You will be near a satellite factory enabling collaboration with satellite engineers to ensure electronics packaging solutions meet the demanding space environment. Develop your technical competence and leadership skills in a company with strong potential for long‑term career growth. Position Responsibilities
Coordinate with multi‑discipline groups to understand requirements and develop high‑level and detailed designs consistent with those requirements. Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements. Perform detailed structural and thermal analysis using hand calculations and analysis tools. Document structural analyses and data to show compliance with Boeing, customer and regulatory requirements at module, slice, and unit levels. Collaborate with Electrical Engineering to perform sizing and placement studies, and layout and route PCBs. Validate designs through reviews, testing and analysis. Develop, deploy and support new processes and process improvements to enable efficient engineering tasks, reduce cycle time and drive product improvements. Conduct Root Cause and Corrective Action to investigate failures and define go‑forward plans. Identify, track and report technical performance measures to ensure compliance with requirements. Support Supplier Management with make/buy recommendations and other technical services of limited scope. Investigate emerging technologies to develop concepts for future product designs to meet projected requirements. Work under general direction. Basic Qualifications (Required Skills/Experience)
Bachelor of Science degree in engineering, engineering technology, chemistry, physics, mathematics, data science, or computer science from an accredited program. Ability to obtain a U.S. Security Clearance (U.S. Citizenship required). Experience using Computer-Aided Design (CAD) tools. Experience with DFMAT (Design for Manufacturing, Assembly & Test). Experience with thermal, structural, dynamics, and/or vibration analysis and tools – OR experience with PCB design or assembly. Preferred Qualifications (Desired Skills/Experience)
3+ years of related work experience or an equivalent combination of education and experience 5+ years of related work experience or an equivalent combination of education and experience Experience with electronic packaging design and/or analysis Experience within aerospace or space electronics industry Experience with ANSYS, Creo, SolidWorks, FEA, Siemens NX Nastran, MSC Patran, COMSOL Excellent oral and written communication skills across disciplines Ability to collect, organize, synthesize and analyze data; summarize findings and develop recommendations Experience leading teams on complex projects Other job details
Drug Free Workplace: Boeing requires post‑offer applicants and employees to comply with drug testing policies. Pay & Benefits: Boeing offers a Total Rewards package including base pay, variable compensation, and benefits such as health insurance, retirement plans, and paid time off. Pay ranges vary by level and location. Summary pay ranges (illustrative): Associate: 85,850 – 116,150; Mid‑Level: 104,550 – 141,450; Senior: 126,650 – 171,350. Applications accepted until Oct. 24, 2025. Export Control: This position must meet export control compliance requirements. U.S. Person status may be required. Education: Bachelor’s Degree or equivalent required. Relocation: This position offers relocation assistance based on eligibility. Security Clearance: Ability to obtain a U.S. Security Clearance; Interim/Final Top Secret/SCI may be required post‑start. Visa Sponsorship: Boeing will not sponsor applicants for employment visa status. Shift: This position is for 1st shift. Equal Opportunity Employer: Boeing does not discriminate based on race, color, religion, national origin, gender, sexual orientation, gender identity, age, disability, or protected characteristics.
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