Micron Technology
Principal Process Engineer, Die Bonding
Micron Technology, Boise, Idaho, United States, 83708
Overview
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Principal Process Engineer, Die Bonding
role at
Micron Technology . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The Advanced Packaging Technology Development (APTD) department at Micron leads the advancement of memory and storage interconnects and packaging solutions. This role supports developing innovative processes and technologies for next-generation semiconductor products and works with global R&D, equipment and materials suppliers, and manufacturing teams to ensure efficient development, transfer and implementation of new technology nodes. As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, focusing on process yield improvement, cost reduction, productivity improvement, and risk management, as well as resolving manufacturing line problems. You will also identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.
Responsibilities
Develop, diagnose, and resolve various die bonding process technologies Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step Lead and participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives Support SPC/FDC/RMS/APC and site-to-site portability Support internal and external audits
Minimum Qualifications
A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering Solid engineering knowledge of semiconductor advanced packaging die stacking processes Skilled at designing valid tests and Design of Experiments (DOE) Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs Excellent oral and written communication skills and a strong attention to detail Highly self-motivated and have the ability to work independently, as a group leader, and as a collaborative contributor Knowledge and an understanding of project management
Preferred Qualifications
Masters or Doctorate degree in Engineering, Physics, or related field Experience in working on Die Bonding: Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator
Micron is an equal opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work, please review the information on the Micron careers site.
For US sites: For assistance with the application process or for reasonable accommodations, contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (option #3).
Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates recruitment fees or request any payment for employment consideration.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. All information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate qualifications will result in disqualification.
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Join to apply for the
Principal Process Engineer, Die Bonding
role at
Micron Technology . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The Advanced Packaging Technology Development (APTD) department at Micron leads the advancement of memory and storage interconnects and packaging solutions. This role supports developing innovative processes and technologies for next-generation semiconductor products and works with global R&D, equipment and materials suppliers, and manufacturing teams to ensure efficient development, transfer and implementation of new technology nodes. As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, focusing on process yield improvement, cost reduction, productivity improvement, and risk management, as well as resolving manufacturing line problems. You will also identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.
Responsibilities
Develop, diagnose, and resolve various die bonding process technologies Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step Lead and participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives Support SPC/FDC/RMS/APC and site-to-site portability Support internal and external audits
Minimum Qualifications
A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering Solid engineering knowledge of semiconductor advanced packaging die stacking processes Skilled at designing valid tests and Design of Experiments (DOE) Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs Excellent oral and written communication skills and a strong attention to detail Highly self-motivated and have the ability to work independently, as a group leader, and as a collaborative contributor Knowledge and an understanding of project management
Preferred Qualifications
Masters or Doctorate degree in Engineering, Physics, or related field Experience in working on Die Bonding: Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator
Micron is an equal opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work, please review the information on the Micron careers site.
For US sites: For assistance with the application process or for reasonable accommodations, contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (option #3).
Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates recruitment fees or request any payment for employment consideration.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. All information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate qualifications will result in disqualification.
#J-18808-Ljbffr