MetaOption LLC
Senior Electronics Package Design Engineer – MetaOption LLC
MetaOption LLC is looking for an experienced engineering professional to drive the design of advanced packaging solutions, including flip‑chip BGA, ceramic packages, multi‑chip modules, and system‑in‑package architectures.
Primary Skills
Package layout and interconnect design
Signal integrity and thermal management
Flip‑chip, BGA, ceramic, and MCM technologies
System‑in‑package (SiP) architecture design
Experience with Cadence Allegro or equivalent tools
Responsibilities
Design interconnects, substrate stack‑ups, routing strategies, and package layouts.
Verify designs against electrical, thermal, mechanical, and manufacturability requirements.
Collaborate with suppliers and internal teams to align designs with process capabilities.
Support failure analysis and root‑cause investigations.
Document design processes and lead reviews from concept to release.
Mentor junior engineers and support packaging technology roadmaps.
Qualifications
Bachelor’s degree in Electrical Engineering, Materials Science, or related field.
8+ years of experience in IC/electronic packaging design.
Proficiency with Cadence Allegro or equivalent tools.
Expertise in advanced packaging (2.5D/3D, interposers, HBM, fan‑out WLP, wire bond, flip chip, stacked die, ceramic co‑fire, encapsulated modules/BGAs).
Strong knowledge of substrate technologies and manufacturing processes.
Excellent problem‑solving and communication skills.
Preferred
Experience with OSATs/foundries.
High‑speed digital interfaces (PCIe, DDR, SerDes).
Package‑level simulation tools.
Defense packaging for extreme environments.
Why This is a Great Opportunity We are a well‑established, stable company working on long‑term projects featuring cutting‑edge technology. Employees work five days a week on site, with the possibility for a few days of remote work. Only local candidates from Long Island will be considered at this time.
Employment Details Seniority Level: Mid‑Senior level Employment Type: Full‑time
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Primary Skills
Package layout and interconnect design
Signal integrity and thermal management
Flip‑chip, BGA, ceramic, and MCM technologies
System‑in‑package (SiP) architecture design
Experience with Cadence Allegro or equivalent tools
Responsibilities
Design interconnects, substrate stack‑ups, routing strategies, and package layouts.
Verify designs against electrical, thermal, mechanical, and manufacturability requirements.
Collaborate with suppliers and internal teams to align designs with process capabilities.
Support failure analysis and root‑cause investigations.
Document design processes and lead reviews from concept to release.
Mentor junior engineers and support packaging technology roadmaps.
Qualifications
Bachelor’s degree in Electrical Engineering, Materials Science, or related field.
8+ years of experience in IC/electronic packaging design.
Proficiency with Cadence Allegro or equivalent tools.
Expertise in advanced packaging (2.5D/3D, interposers, HBM, fan‑out WLP, wire bond, flip chip, stacked die, ceramic co‑fire, encapsulated modules/BGAs).
Strong knowledge of substrate technologies and manufacturing processes.
Excellent problem‑solving and communication skills.
Preferred
Experience with OSATs/foundries.
High‑speed digital interfaces (PCIe, DDR, SerDes).
Package‑level simulation tools.
Defense packaging for extreme environments.
Why This is a Great Opportunity We are a well‑established, stable company working on long‑term projects featuring cutting‑edge technology. Employees work five days a week on site, with the possibility for a few days of remote work. Only local candidates from Long Island will be considered at this time.
Employment Details Seniority Level: Mid‑Senior level Employment Type: Full‑time
#J-18808-Ljbffr