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Panasonic Avionics Corporation

Mechanical Design Engineer V- Electronic Packaging

Panasonic Avionics Corporation, Irvine, California, United States, 92713

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Mechanical Design Engineer V- Electronic Packaging

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Panasonic Avionics Corporation

Overview Panasonic Avionics Corporation is the #1 industry leader in inflight entertainment and connectivity. The role is based in Irvine, CA and offers a hybrid work model with access to many onsite amenities. The position focuses on developing, designing, and qualifying avionics electromechanical components, products, and systems.

Responsibilities • Lead the design and development of mechanical packages, components, and assemblies. • Provide technical guidance and mentorship to engineering teams. • Coordinate with manufacturing, procurement, and overseas engineering groups to ensure product manufacturability and cost effectiveness. • Drive integration of new and patentable technologies and facilitate cross‑site collaboration.

Major Responsibilities

Oversee the designs and development of mechanical enclosures, components and assemblies utilizing mass production manufacturing techniques.

Apply expert level planning, engineering principles and hands‑on techniques to solve complex engineering challenges.

Oversee the qualitative and quantitative thermal, structural, shock, and vibration analyses.

Ensure compliance with industry specifications (e.g., DO‑160) and product requirements.

Direct the work of technicians, mechanical engineers, electrical engineers, and support personnel.

Lead the integration of patentable and competitive technologies into products.

Determine engineering solutions while considering form, fit, function, thermal, structural rigidity, weight, EMI, ESD, DFM, DFT, product marketing and cost.

Coordinate between the Mechanical Engineering department and procurement, manufacturing, obsolescence, and material planning teams.

Manage the overall technical direction of supporting personnel to resolve design and manufacturing problems.

Participate in CRB (Change Review Board) and facilitate communication for product design changes.

Create conceptual designs, assess risks, and develop cost‑effective products for packaging systems in airborne environments.

Education/Experience Requirements

BS degree in Mechanical Engineering, Mechatronics or related field.

15+ years of mechanical design experience.

Experience with consumer electronics, including servers, computers, mobile phones, and networking equipment.

Proficiency in 3D/2D CAD (Creo, NX, CATIA, SolidWorks).

Knowledge/Skill Requirements

Expert knowledge of solid mechanics, materials science, heat transfer, structural analysis, and electromagnetic shielding.

Expert 3D CAD modeling and tolerance analysis.

Mass‑production manufacturing techniques (sheet metal stamping, plastic injection molding, die casting, CNC machining).

Strong project planning and documentation skills.

Ability to lead multi‑function teams and provide technical guidance.

Understanding of Avionics environmental/EMI/ESD/safety test requirements.

Other Requirements

Ability to travel to Japan and other locations as required (~5% of the time).

Our Principles Contribution to Society | Fairness & Honesty | Cooperation & Team Spirit | Untiring Effort for Improvement | Courtesy & Humility | Adaptability | Gratitude

What We Offer

Competitive salary range: $138,000 – $231,000.

Discretionary bonuses and incentives.

Comprehensive benefits program including paid time off, health insurance, 401K with 50% match, and various state‑specific leave programs.

Additional benefits such as wellness programs, counseling services, vision and dental insurance, life insurance, and more.

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