Altera
Altera
.Director of OSAT Engineering page is loaded## Director of OSAT Engineeringlocations:
San Jose, California, United Statestime type:
Full timeposted on:
Posted Yesterdayjob requisition id:
R01482# **Job Details:**### ## **Job Description:****About Altera**Altera is a leader in programmable logic and FPGA technology—enabling customers in data centers, communications, automotive, aerospace and industrial markets to deliver high-performance hardware solutions. We are committed to innovation, operational excellence, and scaling our manufacturing and backend supply chain to support next-generation devices.**Role Summary**As the Director of OSAT Engineering at Altera, you will lead the engineering organization responsible for our outsourced semiconductor assembly and test (OSAT) partners, ensuring robust process development, qualification, yield ramp, cost control, and risk mitigation for packaging and test of our FPGA/SoC devices. You will work cross-functionally with manufacturing, design, packaging, test, supply chain and quality teams to ensure that our package/test flows meet performance, cost, schedule and yield targets. This is a strategic leadership role with global reach, responsible for driving backend operational excellence of Altera’s product portfolio.**Key Responsibilities*** Define and lead the strategy, roadmap and execution for OSAT engineering activities—assembly, packaging, test, burn-in, final inspection and qualification—across external OSAT partners and internal packaging/test engineering teams.* Serve as the primary technical interface to OSAT suppliers: negotiate and agree on process flows, qualification deliverables, yield improvement initiatives, cost targets, schedule commitments and supplier KPI performance.* Lead new product introduction (NPI) into OSAT partners: establish packaging/test process flows, define yield targets, manage process risk, monitor ramp performance, and ensure volume production readiness.* Drive yield improvement, cost reduction, cycle time reduction, and quality improvement initiatives at OSAT partners; lead root cause analysis, corrective action, reliability/qualification engineering and supplier continuous improvement programs.* Collaborate with design, packaging, test, and manufacturing teams to optimize package/test architecture, support FPGA/SoC product requirements (e.g., high-pin count packages, flip-chip, 2.5D/3D, substrate integration, high-speed I/O, thermal/EM/IR constraints, reliability).* Ensure packaging/test flows and OSAT performance meet cost, quality, schedule and reliability goals for Altera’s roadmap; support management of cost roadmap, supplier contract terms, and alternative sourcing strategies.* Develop and monitor key metrics and dashboards (yield, DPPM, cost per die/package, throughput, cycle time, supplier performance) and report to senior leadership on OSAT health, risks, and mitigation.* Lead cross-functional risk management: identify supply chain / OSAT risk (capacity constraints, technology node transitions, geographic risk, material supply), and develop contingency plans (dual sourcing, alternate OSAT, process flexibility).* Manage engineering team of OSAT process engineers, supplier development engineers and packaging/test specialists: staffing, performance management, career development, capability building and mentoring.* Stay ahead of industry package/test technology trends (e.g., advanced packaging, heterogeneous integration, MEMS packaging, test compression, wafer-level packaging) and partner with OSATs and tool vendors to evaluate new technologies for adoption.* Partner with supply chain, manufacturing operations, and finance to align OSAT engineering strategy with Altera’s product cost, volume ramp and business growth objectives.**Salary Range**The pay range below is for Bay Area California only. Actual salary may vary based on a number of factors including job location, job-related knowledge, skills, experiences, trainings, etc. We also offer incentive opportunities that reward employees based on individual and company performance.**$159700 - $231,250 USD**We use artificial intelligence to screen, assess, or select applicants for the position.### ## **Qualifications:****Minimum Requirements:*** Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Semiconductor Packaging, or a related field. A Master’s degree is preferred.* 12+ years of semiconductor assembly, packaging or test engineering experience, with at least 5 years in a leadership or director-level role managing OSAT or backend manufacturing operations.* Strong technical understanding of outsourced semiconductor assembly and test operations (wire-bond, flip-chip, wafer-level packaging, substrate assembly, final test, burn-in) and OSAT supplier ecosystems.* Proven track record leading packaging/test process development, yield improvement, cost reduction, and ramp to volume in a semiconductor or high-tech manufacturing environment.* Experience working with global OSAT partners and managing complex supply chains (Asia, Europe, Americas).* Excellent cross-functional collaboration and leadership skills: able to influence design, manufacturing, supply chain, test engineers, and senior executives.* Strong data-driven mindset: ability to analyze yield, cost, cycle time, and provide strategic insights and decisions.* Excellent communication skills, both verbal and written; ability to report to senior leadership and drive strategic supplier negotiations.**Preferred Qualifications:*** Experience in high-pin-count FPGA/SoC packaging, advanced packaging (2.5D/3D, fan-out, WLCSP), and high-volume manufacturing.* Experience managing global supplier qualification, dual sourcing, and supply risk mitigation in a semiconductor context.* Knowledge of reliability/qualification standards (e.g., JEDEC, IPC, AEC-Q, automotive grade) and experience with failure analysis.* Familiarity with cost roadmap development, supplier contracts, sourcing negotiations, and total cost of ownership (TCO) in backend operations.* Demonstrated experience building and leading a high-performance engineering organization.* Prior experience with major OSAT vendors and tool/automation vendors for packaging and test.### ## **Job Type:**Regular### ## **Shift:**Shift 1 (United States of America)### ## **Primary Location:**San Jose, California, United States### ## **Additional Locations:**### ## **Posting Statement:**All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. #J-18808-Ljbffr
.Director of OSAT Engineering page is loaded## Director of OSAT Engineeringlocations:
San Jose, California, United Statestime type:
Full timeposted on:
Posted Yesterdayjob requisition id:
R01482# **Job Details:**### ## **Job Description:****About Altera**Altera is a leader in programmable logic and FPGA technology—enabling customers in data centers, communications, automotive, aerospace and industrial markets to deliver high-performance hardware solutions. We are committed to innovation, operational excellence, and scaling our manufacturing and backend supply chain to support next-generation devices.**Role Summary**As the Director of OSAT Engineering at Altera, you will lead the engineering organization responsible for our outsourced semiconductor assembly and test (OSAT) partners, ensuring robust process development, qualification, yield ramp, cost control, and risk mitigation for packaging and test of our FPGA/SoC devices. You will work cross-functionally with manufacturing, design, packaging, test, supply chain and quality teams to ensure that our package/test flows meet performance, cost, schedule and yield targets. This is a strategic leadership role with global reach, responsible for driving backend operational excellence of Altera’s product portfolio.**Key Responsibilities*** Define and lead the strategy, roadmap and execution for OSAT engineering activities—assembly, packaging, test, burn-in, final inspection and qualification—across external OSAT partners and internal packaging/test engineering teams.* Serve as the primary technical interface to OSAT suppliers: negotiate and agree on process flows, qualification deliverables, yield improvement initiatives, cost targets, schedule commitments and supplier KPI performance.* Lead new product introduction (NPI) into OSAT partners: establish packaging/test process flows, define yield targets, manage process risk, monitor ramp performance, and ensure volume production readiness.* Drive yield improvement, cost reduction, cycle time reduction, and quality improvement initiatives at OSAT partners; lead root cause analysis, corrective action, reliability/qualification engineering and supplier continuous improvement programs.* Collaborate with design, packaging, test, and manufacturing teams to optimize package/test architecture, support FPGA/SoC product requirements (e.g., high-pin count packages, flip-chip, 2.5D/3D, substrate integration, high-speed I/O, thermal/EM/IR constraints, reliability).* Ensure packaging/test flows and OSAT performance meet cost, quality, schedule and reliability goals for Altera’s roadmap; support management of cost roadmap, supplier contract terms, and alternative sourcing strategies.* Develop and monitor key metrics and dashboards (yield, DPPM, cost per die/package, throughput, cycle time, supplier performance) and report to senior leadership on OSAT health, risks, and mitigation.* Lead cross-functional risk management: identify supply chain / OSAT risk (capacity constraints, technology node transitions, geographic risk, material supply), and develop contingency plans (dual sourcing, alternate OSAT, process flexibility).* Manage engineering team of OSAT process engineers, supplier development engineers and packaging/test specialists: staffing, performance management, career development, capability building and mentoring.* Stay ahead of industry package/test technology trends (e.g., advanced packaging, heterogeneous integration, MEMS packaging, test compression, wafer-level packaging) and partner with OSATs and tool vendors to evaluate new technologies for adoption.* Partner with supply chain, manufacturing operations, and finance to align OSAT engineering strategy with Altera’s product cost, volume ramp and business growth objectives.**Salary Range**The pay range below is for Bay Area California only. Actual salary may vary based on a number of factors including job location, job-related knowledge, skills, experiences, trainings, etc. We also offer incentive opportunities that reward employees based on individual and company performance.**$159700 - $231,250 USD**We use artificial intelligence to screen, assess, or select applicants for the position.### ## **Qualifications:****Minimum Requirements:*** Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Semiconductor Packaging, or a related field. A Master’s degree is preferred.* 12+ years of semiconductor assembly, packaging or test engineering experience, with at least 5 years in a leadership or director-level role managing OSAT or backend manufacturing operations.* Strong technical understanding of outsourced semiconductor assembly and test operations (wire-bond, flip-chip, wafer-level packaging, substrate assembly, final test, burn-in) and OSAT supplier ecosystems.* Proven track record leading packaging/test process development, yield improvement, cost reduction, and ramp to volume in a semiconductor or high-tech manufacturing environment.* Experience working with global OSAT partners and managing complex supply chains (Asia, Europe, Americas).* Excellent cross-functional collaboration and leadership skills: able to influence design, manufacturing, supply chain, test engineers, and senior executives.* Strong data-driven mindset: ability to analyze yield, cost, cycle time, and provide strategic insights and decisions.* Excellent communication skills, both verbal and written; ability to report to senior leadership and drive strategic supplier negotiations.**Preferred Qualifications:*** Experience in high-pin-count FPGA/SoC packaging, advanced packaging (2.5D/3D, fan-out, WLCSP), and high-volume manufacturing.* Experience managing global supplier qualification, dual sourcing, and supply risk mitigation in a semiconductor context.* Knowledge of reliability/qualification standards (e.g., JEDEC, IPC, AEC-Q, automotive grade) and experience with failure analysis.* Familiarity with cost roadmap development, supplier contracts, sourcing negotiations, and total cost of ownership (TCO) in backend operations.* Demonstrated experience building and leading a high-performance engineering organization.* Prior experience with major OSAT vendors and tool/automation vendors for packaging and test.### ## **Job Type:**Regular### ## **Shift:**Shift 1 (United States of America)### ## **Primary Location:**San Jose, California, United States### ## **Additional Locations:**### ## **Posting Statement:**All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. #J-18808-Ljbffr