Socionext US
ASIC Package Design Engineer - (Si, Pi)
Socionext US, Milpitas, California, United States, 95035
Socionext Inc. (SNI) Overview
Socionext Inc. (SNI) is an innovative enterprise that designs, develops and delivers System-on-Chip solutions to customers worldwide. The company is focused on AR/VR, ADAS, imaging, networking, data storage and other dynamic technologies that drive today’s leading-edge applications. Socionext combines world‑class expertise, experience, and an extensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers. Founded in 2015, Socionext Inc. is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe to lead its product development and sales activities. Socionext America Inc. (SNA), a wholly owned subsidiary of SNI.
Senior Engineer, Package Design (Milpitas, CA) We are seeking a
Senior Engineer, Package Design
to work from our Milpitas, CA office.
Base Pay Range $180,000.00/yr - $215,000.00/yr
Direct message the job poster from Socionext US
Responsibilities The Package Engineering function provides support, expertise, and insight to the Silicon device development team through preliminary activities of package selection, routing techniques and necessary simulation work. The position involves diverse responsibilities, including evaluation of new packaging technology, package recommendation for custom devices, substrate design support, device/package qualification. You will be reporting to the Director of Package design (USA) and also you will be working very closely with Package/Manufacturing team in our headquarter (Japan), Marketing and Engineering teams located in our Santa Clara office during pre/post sales process.
Qualifications Education Bachelor’s degree in Electrical Engineering, or other semiconductor packaging related discipline
Required Experience and Skills
8 to 10 years of experience in semiconductor packaging design and simulations
Record of success in cross-functional team environment
Good experience with SI/PI tools for package level extraction/simulation
Ability to work with Package Layout engineers
Strong presentation and communication skills
Preferred Experience and Skills
Good knowledge of IC package materials and manufacturing
Benefits
Medical insurance
Vision insurance
401(k)
Disability insurance
Tuition assistance
Location Milpitas, CA
#J-18808-Ljbffr
Senior Engineer, Package Design (Milpitas, CA) We are seeking a
Senior Engineer, Package Design
to work from our Milpitas, CA office.
Base Pay Range $180,000.00/yr - $215,000.00/yr
Direct message the job poster from Socionext US
Responsibilities The Package Engineering function provides support, expertise, and insight to the Silicon device development team through preliminary activities of package selection, routing techniques and necessary simulation work. The position involves diverse responsibilities, including evaluation of new packaging technology, package recommendation for custom devices, substrate design support, device/package qualification. You will be reporting to the Director of Package design (USA) and also you will be working very closely with Package/Manufacturing team in our headquarter (Japan), Marketing and Engineering teams located in our Santa Clara office during pre/post sales process.
Qualifications Education Bachelor’s degree in Electrical Engineering, or other semiconductor packaging related discipline
Required Experience and Skills
8 to 10 years of experience in semiconductor packaging design and simulations
Record of success in cross-functional team environment
Good experience with SI/PI tools for package level extraction/simulation
Ability to work with Package Layout engineers
Strong presentation and communication skills
Preferred Experience and Skills
Good knowledge of IC package materials and manufacturing
Benefits
Medical insurance
Vision insurance
401(k)
Disability insurance
Tuition assistance
Location Milpitas, CA
#J-18808-Ljbffr