Energy Jobline ZR
Packaging Design Engineer - Optical Interfaces in Santa Clara
Energy Jobline ZR, Santa Clara, California, us, 95053
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Job DescriptionJob DescriptionThis role is for a highly skilled and experienced
Packaging Design Engineer
to lead the development of our next- silicon photonics packaging solutions. You will be the primary architect of our optical interfacing processes, ensuring high performance and exceptional reliability. You will own the entire process, from the collaborative design of the optical and mechanical structures to process implementation and optimization with our contract manufacturing partners.This is a hands-on technical position requiring a deep understanding of precision optical assembly. You will work closely with our integrated circuit (IC) design, mechanical, and reliability teams to create robust, manufacturable packaging solutions. Your expertise will be vital for pushing the boundaries of fiber-to-chip coupling efficiency, mechanical stability, and long-term product reliability.Key Responsibilities
Process Design & Development: (1)
Design and develop robust, high-yield processes for active and passive optical interfaces to photonic integrated circuits (PICs), regardless of the underlying waveguide technology (e.g., Si, SiN, InP).
(2)
Specialize in using advanced methods to achieve stable and reliable fiber coupling. This includes selecting appropriate materials and controlling critical parameters.
(3)
Collaborate with IC and mechanical design teams to define and create structures that minimize stress, ensure thermal stability, and enhance the overall reliability of the package.
Manufacturing & Collaboration: (1)
Act as the key technical interface with our contract manufacturing partners, coordinating process design, implementation, and characterization to ensure a smooth transition from development to high-volume production.
(2)
Define and manage critical process controls, alignment tolerances, and metrology methods to ensure consistent, high-performance output in a manufacturing environment.
(3)
Conduct in-depth analysis of assembly and packaging yield data to drive continuous process improvement.
Reliability & Performance: (1)
Define and implement test methodologies to characterize the reliability of packaged devices under various environmental and mechanical stresses.
(2)
Analyze reliability data to identify potential failure modes and work with design teams to implement corrective actions.
(3)
Utilize your understanding of thermal, modal, and stress/strain principles to predict and mitigate reliability risks associated with packaging.
Minimum Qualifications
Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Materials Science, Optical Engineering, or a related field.5+ years of hands-on experience in packaging design for optical or photonic components.
Demonstrable experience with optical interfacing to PICs, including proficiency with active and passive alignment techniques.
In-depth knowledge of packaging materials, including optical adhesives and epoxies, and their design constraints, and how to use them in a high reliability application.
Proven ability to work with contract manufacturers to design, implement, and ramp packaging processes to volume production.
A strong understanding of reliability engineering principles, including failure mechanisms related to packaging, and experience with relevant testing standards (e.g., Telcordia).
Experience with CAD tools for mechanical design and packaging layouts.
Skills
Direct experience with PIC optical edge coupling and associated challenges.
Familiarity with various waveguide technologies and their impact on packaging design.
Knowledge of semiconductor fabrication processes and their constraints on packaging.
Experience with Finite Element Analysis (FEA) software for stress, thermal, or modal simulations.
Excellent problem-solving skills and a track record of driving complex technical challenges from concept to solution.
Strong communication and collaboration skills, with the ability to work effectively across interdisciplinary teams.
Starting salary and title will depend on, and be commensurate with, relevant experience, skills, training, education, market demands, and the ultimate job duties and requirements. nEye is an Equal Opportunity Employer . All qualified applicants will receive consideration for employment without regard to , , , , , , , , , protected veteran status, or any other characteristic protected by law.
We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
If you are interested in applying for this job please press the Apply Button and follow the application process. Energy Jobline wishes you the very best of luck in your next career move.
We focus on the Oil & Gas, Renewables, Engineering, Power, and Nuclear markets as well as emerging technologies in EV, Battery, and Fusion. We are committed to ensuring that we offer the most exciting career opportunities from around the world for our jobseekers.
Job DescriptionJob DescriptionThis role is for a highly skilled and experienced
Packaging Design Engineer
to lead the development of our next- silicon photonics packaging solutions. You will be the primary architect of our optical interfacing processes, ensuring high performance and exceptional reliability. You will own the entire process, from the collaborative design of the optical and mechanical structures to process implementation and optimization with our contract manufacturing partners.This is a hands-on technical position requiring a deep understanding of precision optical assembly. You will work closely with our integrated circuit (IC) design, mechanical, and reliability teams to create robust, manufacturable packaging solutions. Your expertise will be vital for pushing the boundaries of fiber-to-chip coupling efficiency, mechanical stability, and long-term product reliability.Key Responsibilities
Process Design & Development: (1)
Design and develop robust, high-yield processes for active and passive optical interfaces to photonic integrated circuits (PICs), regardless of the underlying waveguide technology (e.g., Si, SiN, InP).
(2)
Specialize in using advanced methods to achieve stable and reliable fiber coupling. This includes selecting appropriate materials and controlling critical parameters.
(3)
Collaborate with IC and mechanical design teams to define and create structures that minimize stress, ensure thermal stability, and enhance the overall reliability of the package.
Manufacturing & Collaboration: (1)
Act as the key technical interface with our contract manufacturing partners, coordinating process design, implementation, and characterization to ensure a smooth transition from development to high-volume production.
(2)
Define and manage critical process controls, alignment tolerances, and metrology methods to ensure consistent, high-performance output in a manufacturing environment.
(3)
Conduct in-depth analysis of assembly and packaging yield data to drive continuous process improvement.
Reliability & Performance: (1)
Define and implement test methodologies to characterize the reliability of packaged devices under various environmental and mechanical stresses.
(2)
Analyze reliability data to identify potential failure modes and work with design teams to implement corrective actions.
(3)
Utilize your understanding of thermal, modal, and stress/strain principles to predict and mitigate reliability risks associated with packaging.
Minimum Qualifications
Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Materials Science, Optical Engineering, or a related field.5+ years of hands-on experience in packaging design for optical or photonic components.
Demonstrable experience with optical interfacing to PICs, including proficiency with active and passive alignment techniques.
In-depth knowledge of packaging materials, including optical adhesives and epoxies, and their design constraints, and how to use them in a high reliability application.
Proven ability to work with contract manufacturers to design, implement, and ramp packaging processes to volume production.
A strong understanding of reliability engineering principles, including failure mechanisms related to packaging, and experience with relevant testing standards (e.g., Telcordia).
Experience with CAD tools for mechanical design and packaging layouts.
Skills
Direct experience with PIC optical edge coupling and associated challenges.
Familiarity with various waveguide technologies and their impact on packaging design.
Knowledge of semiconductor fabrication processes and their constraints on packaging.
Experience with Finite Element Analysis (FEA) software for stress, thermal, or modal simulations.
Excellent problem-solving skills and a track record of driving complex technical challenges from concept to solution.
Strong communication and collaboration skills, with the ability to work effectively across interdisciplinary teams.
Starting salary and title will depend on, and be commensurate with, relevant experience, skills, training, education, market demands, and the ultimate job duties and requirements. nEye is an Equal Opportunity Employer . All qualified applicants will receive consideration for employment without regard to , , , , , , , , , protected veteran status, or any other characteristic protected by law.
We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
If you are interested in applying for this job please press the Apply Button and follow the application process. Energy Jobline wishes you the very best of luck in your next career move.