Neurophos
Principal AI Photonics Processor Reliability and Failure Analysis Engineer
Neurophos, Austin, Texas, us, 78716
Principal AI Photonics Processor Reliability and Failure Analysis Engineer
About Neurophos: At Neurophos, we are revolutionizing AI computation with a groundbreaking photonic module that promises to redefine industry standards. After three years of stealth R&D, we have engineered a technology platform delivering 100x performance gains in neural computing— powering applications like Large Language Models (LLMs) and next‑generation AI architectures. By integrating metamaterials with conventional optoelectronics, our compute‑in‑memory optical system surpasses existing solutions, paving the way for the future of AI hardware. We are scaling our elite engineering team to bring this transformative technology to market. Join us to shape the future of optical computing.
Position Overview We are seeking an experienced individual contributor in reliability engineering to take ownership of the company's quality and reliability methodologies, standards, and validation programs, as well as our failure analysis activities for our innovative photonic AI modules. This hands‑on role involves defining and implementing comprehensive reliability strategies, conducting failure analysis, and ensuring the long‑term reliability of components and materials such as metasurfaces, silicon photonics, integrated circuits, free space optics, and integrated modules. You will define reliability goals and statistically‑driven tests for internal and outsourced reliability validation, perform risk assessments, analyze results, and collaborate closely with hyperscaler customers to align on reliability requirements. You will drive efforts to mitigate reliability risks, optimize processes, and support the transition from prototyping to high‑volume manufacturing in a fast‑paced startup environment focused on cutting‑edge optical and AI technologies.
Key Responsibilities
Establish the company's reliability methodologies and standards, including the development of physics‑of‑failure (PoF)-based models, reliability criteria, and lifetime projections for photonic and electronic components.
Design and implement the reliability validation program, defining stress test plans (e.g., thermal cycling, humidity, electromigration, and environmental stress testing) while overseeing outsourced execution to ensure compliance with industry standards like JEDEC, Telecordia, IPC, and IEEE.
Conduct detailed failure analysis investigations, including root cause identification using techniques such as SEM, EDX, FIB, TEM, X‑ray, and CSAM, and implement corrective and preventive actions (CAPA) to enhance product reliability.
Utilize statistical methods and data analysis to define and validate FIT rates, analyze failure trends, generate reliability models, and summarize results in comprehensive reports for internal teams and hyperscaler customers.
Collaborate with cross‑functional teams in silicon photonics, optical engineering, and VLSI design to assess reliability risks from thermal, mechanical, electrical, and optical stressors, optimizing module architectures for robustness and manufacturability.
Serve as the primary interface with hyperscaler customers on reliability concerns, addressing requests, providing technical updates, and aligning on pareto analyses and qualification reports.
Research and stay current on product-level reliability for optical modules, including failure mechanisms in metasurfaces, waveguides, modulators, photodetectors, and integrated systems, drawing from literature, industry standards, and ecosystem partnerships.
Work with external partners (e.g., OSATs and foundries) to evaluate manufacturing capabilities, monitor reliability qualifications, and drive continuous improvements in processes and materials.
Perform hands‑on work in lab settings, such as analyzing prototypes, validating concepts, and iterating designs based on empirical data.
Qualifications
Ph.D. in Physics, Materials Science, Electrical Engineering, Applied Physics, or a related field, with a solid foundation in semiconductor device physics and failure mechanisms.
10+ years of hands‑on experience in reliability engineering, failure analysis, and validation for semiconductor or photonic technologies, including silicon photonics, VLSI devices, and optical modules.
Deep expertise in reliability theory and practice, including PoF modeling, statistical analysis, data mining, and empirical data‑driven improvements for FIT rates and lifetime projections.
Proficiency in advanced analytical techniques such as SEM, SIMS, EDX, FIB, TEM, X‑ray, CSAM, and TDR, with experience in fault isolation and root cause analysis for FEOL, BEOL, packaging, and photonic components.
Strong understanding of reliability standards (e.g., JEDEC) and experience defining test structures, executing stress tests, and managing outsourced qualifications.
Experience with reliability projects from concept through high‑volume manufacturing, including DFX (design for testability, reliability, availability, and serviceability) for AI hardware.
Familiarity with environmental stress testing methodologies (e.g., thermal cycling, vibration) and tools like ANSYS for thermal‑mechanical modeling.
Background in quality assurance, including FMEA, MBPS, and cross‑functional aspects like DFM/DFT and cost considerations.
Strong communication skills for presenting technical findings to senior leadership, customers, and cross‑functional teams, with the ability to thrive in a dynamic startup environment.
Preferred Qualifications
Proven track record of working with large customers on reliability validation programs, risk assessments, and qualification processes.
What We Offer
A key role in a cutting‑edge AI hardware startup.
A collaborative and innovative work environment.
Opportunities for personal and professional growth in a dynamic industry.
If you are a passionate and talented reliability expert who thrives on challenges and innovation, we encourage you to apply.
Referrals increase your chances of interviewing at Neurophos by 2x
Austin, TX $80,000.00-$160,000.00
#J-18808-Ljbffr
Position Overview We are seeking an experienced individual contributor in reliability engineering to take ownership of the company's quality and reliability methodologies, standards, and validation programs, as well as our failure analysis activities for our innovative photonic AI modules. This hands‑on role involves defining and implementing comprehensive reliability strategies, conducting failure analysis, and ensuring the long‑term reliability of components and materials such as metasurfaces, silicon photonics, integrated circuits, free space optics, and integrated modules. You will define reliability goals and statistically‑driven tests for internal and outsourced reliability validation, perform risk assessments, analyze results, and collaborate closely with hyperscaler customers to align on reliability requirements. You will drive efforts to mitigate reliability risks, optimize processes, and support the transition from prototyping to high‑volume manufacturing in a fast‑paced startup environment focused on cutting‑edge optical and AI technologies.
Key Responsibilities
Establish the company's reliability methodologies and standards, including the development of physics‑of‑failure (PoF)-based models, reliability criteria, and lifetime projections for photonic and electronic components.
Design and implement the reliability validation program, defining stress test plans (e.g., thermal cycling, humidity, electromigration, and environmental stress testing) while overseeing outsourced execution to ensure compliance with industry standards like JEDEC, Telecordia, IPC, and IEEE.
Conduct detailed failure analysis investigations, including root cause identification using techniques such as SEM, EDX, FIB, TEM, X‑ray, and CSAM, and implement corrective and preventive actions (CAPA) to enhance product reliability.
Utilize statistical methods and data analysis to define and validate FIT rates, analyze failure trends, generate reliability models, and summarize results in comprehensive reports for internal teams and hyperscaler customers.
Collaborate with cross‑functional teams in silicon photonics, optical engineering, and VLSI design to assess reliability risks from thermal, mechanical, electrical, and optical stressors, optimizing module architectures for robustness and manufacturability.
Serve as the primary interface with hyperscaler customers on reliability concerns, addressing requests, providing technical updates, and aligning on pareto analyses and qualification reports.
Research and stay current on product-level reliability for optical modules, including failure mechanisms in metasurfaces, waveguides, modulators, photodetectors, and integrated systems, drawing from literature, industry standards, and ecosystem partnerships.
Work with external partners (e.g., OSATs and foundries) to evaluate manufacturing capabilities, monitor reliability qualifications, and drive continuous improvements in processes and materials.
Perform hands‑on work in lab settings, such as analyzing prototypes, validating concepts, and iterating designs based on empirical data.
Qualifications
Ph.D. in Physics, Materials Science, Electrical Engineering, Applied Physics, or a related field, with a solid foundation in semiconductor device physics and failure mechanisms.
10+ years of hands‑on experience in reliability engineering, failure analysis, and validation for semiconductor or photonic technologies, including silicon photonics, VLSI devices, and optical modules.
Deep expertise in reliability theory and practice, including PoF modeling, statistical analysis, data mining, and empirical data‑driven improvements for FIT rates and lifetime projections.
Proficiency in advanced analytical techniques such as SEM, SIMS, EDX, FIB, TEM, X‑ray, CSAM, and TDR, with experience in fault isolation and root cause analysis for FEOL, BEOL, packaging, and photonic components.
Strong understanding of reliability standards (e.g., JEDEC) and experience defining test structures, executing stress tests, and managing outsourced qualifications.
Experience with reliability projects from concept through high‑volume manufacturing, including DFX (design for testability, reliability, availability, and serviceability) for AI hardware.
Familiarity with environmental stress testing methodologies (e.g., thermal cycling, vibration) and tools like ANSYS for thermal‑mechanical modeling.
Background in quality assurance, including FMEA, MBPS, and cross‑functional aspects like DFM/DFT and cost considerations.
Strong communication skills for presenting technical findings to senior leadership, customers, and cross‑functional teams, with the ability to thrive in a dynamic startup environment.
Preferred Qualifications
Proven track record of working with large customers on reliability validation programs, risk assessments, and qualification processes.
What We Offer
A key role in a cutting‑edge AI hardware startup.
A collaborative and innovative work environment.
Opportunities for personal and professional growth in a dynamic industry.
If you are a passionate and talented reliability expert who thrives on challenges and innovation, we encourage you to apply.
Referrals increase your chances of interviewing at Neurophos by 2x
Austin, TX $80,000.00-$160,000.00
#J-18808-Ljbffr