Insight Global
This range is provided by Insight Global. Your actual pay will be based on your skills and experience — talk with your recruiter to learn more.
Base pay range $100,000.00/yr - $150,000.00/yr
Direct message the job poster from Insight Global
Insight Global is looking for an Equipment Engineer with a key focus in bonding to work on site in Austin, TX and support the strategy and introduction of products based on unique and highly differentiated capabilities of a preeminent foundry for semiconductor systems and defense electronics companies. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting‑edge semiconductor manufacturing technology that will define future roadmaps of semiconductor devices including logic, memory, 3D packaged devices, including thermal management, etc.
Responsibilities
Running, developing and integrating semiconductor fabrication processes across a wide variety of semiconductor equipment.
Running experiments, performing detailed process characterization, performing data analysis, documenting processes of record, presenting results, and incorporating feedback from engineers/techs.
Developing processes‑of‑record and implementing these on product samples for customers.
Assisting with documents such as proposals or reports on costs and inventory levels.
Required skills and experience
5+ years of experience as an Equipment Engineer in the semiconductor industry.
Proficient with bonding tools.
Experience with pick‑and‑place, die‑to‑wafer bonding, or wafer‑to‑wafer bonding for ultra‑small or small size die.
Experience working in a fab/cleanroom environment.
Bachelor’s degree in materials science, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines.
Nice to have skills and experience
Experience with advanced packaging.
Seniority level Mid‑Senior level
Employment type Full‑time
Job function Manufacturing
Industries Semiconductor Manufacturing
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Base pay range $100,000.00/yr - $150,000.00/yr
Direct message the job poster from Insight Global
Insight Global is looking for an Equipment Engineer with a key focus in bonding to work on site in Austin, TX and support the strategy and introduction of products based on unique and highly differentiated capabilities of a preeminent foundry for semiconductor systems and defense electronics companies. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting‑edge semiconductor manufacturing technology that will define future roadmaps of semiconductor devices including logic, memory, 3D packaged devices, including thermal management, etc.
Responsibilities
Running, developing and integrating semiconductor fabrication processes across a wide variety of semiconductor equipment.
Running experiments, performing detailed process characterization, performing data analysis, documenting processes of record, presenting results, and incorporating feedback from engineers/techs.
Developing processes‑of‑record and implementing these on product samples for customers.
Assisting with documents such as proposals or reports on costs and inventory levels.
Required skills and experience
5+ years of experience as an Equipment Engineer in the semiconductor industry.
Proficient with bonding tools.
Experience with pick‑and‑place, die‑to‑wafer bonding, or wafer‑to‑wafer bonding for ultra‑small or small size die.
Experience working in a fab/cleanroom environment.
Bachelor’s degree in materials science, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines.
Nice to have skills and experience
Experience with advanced packaging.
Seniority level Mid‑Senior level
Employment type Full‑time
Job function Manufacturing
Industries Semiconductor Manufacturing
#J-18808-Ljbffr