Qualcomm
Senior Hardware Design Engineer
San Diego, CA
Company Qualcomm Technologies, Inc.
Job Area Engineering Group > Hardware Engineering
General Summary Qualcomm Cloud System Hardware and Validation Engineering develops cutting‑edge rack‑level AI inference solutions for next‑generation liquid‑cooled data centers. As part of its rapid expansion, the team is looking for experienced engineers to join and contribute to the next round of innovative AI products that Qualcomm intends to bring to market.
Job Overview Design and develop motherboards, add‑in cards and modules for Qualcomm’s new AI System‑on‑Chip (SoC) and System‑in‑Package (SIP). Work with cross‑functional teams (mechanical, thermal, SI, PTE, regulatory, validation, manufacturing, etc.) to execute projects from concept to production. Support rack‑level design and integration of cards, servers, and networking switches.
Responsibilities
Lead schematics design, PCB layouts, design reviews, component selections, mechanical and thermal designs, and develop test plans.
Co‑develop functional specifications for systems, cards, sub‑systems, and rack‑level architectures.
Collaborate with internal teams and ODMs to develop and support customer‑specific hardware and system requirements.
Facilitate consensus on technical trade‑offs at hardware, software, and chip design levels.
Support architecture and card designs including accelerator SoCs, memory, I/O, power delivery, electrical/mechanical integration, and PCB definition/design.
Participate in the design and development of rack‑level inference solutions, ensuring alignment with customer requirements and system‑level performance goals.
Resolve architecture and design issues across system, card, and rack levels.
Assist in the bring‑up and debugging of hardware systems, cards, and rack‑level configurations.
Provide technical oversight of factory and manufacturing processes, ensuring quality and consistency across rack‑level deployments.
Contribute to writing Statements of Work (SOWs) and ODM product requirements; drive technical milestones and deliverables.
Coordinate across multiple development sites, including Qualcomm locations and ODM/JDM partners in Taiwan and internationally.
Travel to development and customer sites as needed to support rack‑level solution deployment and validation.
Influence and communicate technical recommendations across disciplines and geographic locations.
Coordinate and deliver technical training for ODMs, focusing on rack‑level system integration and deployment.
Required Experience
System/card/rack‑level development, including architecture, design, validation, and deployment of enterprise‑class hardware platforms.
Rack‑Level Expertise
Proven experience in rack‑level system integration, including chassis, backplane, cabling, airflow, and thermal management across multiple cards/modules.
Familiarity with rack‑scale power delivery, including PDUs, VRMs, PMICs, and power budgeting across multiple boards.
Experience with rack‑level diagnostics and bring‑up, including debugging interconnects, signal integrity across long traces/cables, and system‑level validation.
Understanding of rack‑level mechanical constraints, EMI shielding, and compliance with data center deployment standards.
Collaboration with ODMs/OEMs on rack‑level design and manufacturing, including review of mechanical drawings, thermal simulations, and compliance testing.
Board‑Level Design
Deep knowledge of PCIe cards, motherboards, daughtercards, and backplane signal and power delivery.
Expertise in chassis design, airflow optimization, and thermal management.
Solid understanding of system software operation from bootloader to OS and application layers.
Component Qualification
Experience qualifying PMICs, voltage regulators, clock buffers, flash memory, and connectors for complex card and rack‑level designs.
Design & Validation
Hands‑on experience in dense, high‑layer count PCB designs (8 – 20+ layers).
Skilled in PCIe add‑in card/module design, debugging in high‑performance systems (x86 and ARM).
Familiarity with JTAG tools for bring‑up and debug.
Experience with networking switches and high‑speed Ethernet interfaces.
High‑Speed Interfaces
Knowledge of high‑speed serial I/O (6 – 10+ Gbps), PCIe Gen5/6, LPDDR4x/5x, DDR4/5, 200/400/800 GbE.
Experience with long PCB/cable topologies (0.35 – 1.5 meter), signal integrity, and compliance with current standards.
Ability to debug at packet/protocol level across link, transport, transaction, and command layers.
Memory & Clocking
Experience with LPDDR4x memory technologies, DIMM layout and validation.
Expertise in clock distribution, power distribution, SMBus, PMBus, SPI, PWM/Tach, and BMC integration.
Tools & Collaboration
Proficient in schematic capture and PCB layout tools (Cadence Allegro, Mentor Expedition).
Experience with circuit simulation tools (SPICE), signal/power integrity analysis.
Skilled in using lab equipment: oscilloscopes, logic analyzers, JTAG, SMBus, serial debuggers.
Strong collaboration with ODMs on joint designs, schematic/layout reviews, and compliance to Qualcomm design guidelines.
Firmware & Software
Good understanding of x86 firmware/software stack and firmware architecture.
Experience with BMC hardware/software integration and management.
Compliance & Testing
Familiarity with regulatory, environmental, and compliance testing for rack‑level systems.
Preferred Qualifications
Master’s Degree in Electrical and Electronic Engineering, Computer Engineering, or related field.
10+ years hardware engineering / systems development experience.
4+ years experience with circuit design (digital, analog, RF).
4+ years experience utilizing schematic capture and circuit simulation software.
4+ years experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, debug tools.
Minimum Qualifications
Bachelor’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering experience.
OR Master’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering experience.
OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering experience.
EEO and Accessibility Statement Qualcomm is an equal‑opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process. Contact disability‑accomodations@qualcomm.com or call Qualcomm’s toll‑free number found here. Qualcomm will provide reasonable accommodations upon request.
To all staffing and recruiting agencies: Our careers site is only for individuals seeking a job at Qualcomm. The site does not accept unsolicited resumes or applications from agencies. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
Qualcomm expects employees to abide by all applicable policies and procedures, including security and confidentiality requirements, to the extent those are permissible under applicable law.
Pay Range and Other Compensation & Benefits $162,600.00 – $244,000.00. The above pay scale reflects the broad, minimum to maximum pay range for this role. Salary is only one component of total compensation. Qualcomm offers a competitive discretionary bonus program, RSU grants, and a highly competitive benefits package designed to support success at work, at home, and at play. Please contact Qualcomm Careers for more details.
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Company Qualcomm Technologies, Inc.
Job Area Engineering Group > Hardware Engineering
General Summary Qualcomm Cloud System Hardware and Validation Engineering develops cutting‑edge rack‑level AI inference solutions for next‑generation liquid‑cooled data centers. As part of its rapid expansion, the team is looking for experienced engineers to join and contribute to the next round of innovative AI products that Qualcomm intends to bring to market.
Job Overview Design and develop motherboards, add‑in cards and modules for Qualcomm’s new AI System‑on‑Chip (SoC) and System‑in‑Package (SIP). Work with cross‑functional teams (mechanical, thermal, SI, PTE, regulatory, validation, manufacturing, etc.) to execute projects from concept to production. Support rack‑level design and integration of cards, servers, and networking switches.
Responsibilities
Lead schematics design, PCB layouts, design reviews, component selections, mechanical and thermal designs, and develop test plans.
Co‑develop functional specifications for systems, cards, sub‑systems, and rack‑level architectures.
Collaborate with internal teams and ODMs to develop and support customer‑specific hardware and system requirements.
Facilitate consensus on technical trade‑offs at hardware, software, and chip design levels.
Support architecture and card designs including accelerator SoCs, memory, I/O, power delivery, electrical/mechanical integration, and PCB definition/design.
Participate in the design and development of rack‑level inference solutions, ensuring alignment with customer requirements and system‑level performance goals.
Resolve architecture and design issues across system, card, and rack levels.
Assist in the bring‑up and debugging of hardware systems, cards, and rack‑level configurations.
Provide technical oversight of factory and manufacturing processes, ensuring quality and consistency across rack‑level deployments.
Contribute to writing Statements of Work (SOWs) and ODM product requirements; drive technical milestones and deliverables.
Coordinate across multiple development sites, including Qualcomm locations and ODM/JDM partners in Taiwan and internationally.
Travel to development and customer sites as needed to support rack‑level solution deployment and validation.
Influence and communicate technical recommendations across disciplines and geographic locations.
Coordinate and deliver technical training for ODMs, focusing on rack‑level system integration and deployment.
Required Experience
System/card/rack‑level development, including architecture, design, validation, and deployment of enterprise‑class hardware platforms.
Rack‑Level Expertise
Proven experience in rack‑level system integration, including chassis, backplane, cabling, airflow, and thermal management across multiple cards/modules.
Familiarity with rack‑scale power delivery, including PDUs, VRMs, PMICs, and power budgeting across multiple boards.
Experience with rack‑level diagnostics and bring‑up, including debugging interconnects, signal integrity across long traces/cables, and system‑level validation.
Understanding of rack‑level mechanical constraints, EMI shielding, and compliance with data center deployment standards.
Collaboration with ODMs/OEMs on rack‑level design and manufacturing, including review of mechanical drawings, thermal simulations, and compliance testing.
Board‑Level Design
Deep knowledge of PCIe cards, motherboards, daughtercards, and backplane signal and power delivery.
Expertise in chassis design, airflow optimization, and thermal management.
Solid understanding of system software operation from bootloader to OS and application layers.
Component Qualification
Experience qualifying PMICs, voltage regulators, clock buffers, flash memory, and connectors for complex card and rack‑level designs.
Design & Validation
Hands‑on experience in dense, high‑layer count PCB designs (8 – 20+ layers).
Skilled in PCIe add‑in card/module design, debugging in high‑performance systems (x86 and ARM).
Familiarity with JTAG tools for bring‑up and debug.
Experience with networking switches and high‑speed Ethernet interfaces.
High‑Speed Interfaces
Knowledge of high‑speed serial I/O (6 – 10+ Gbps), PCIe Gen5/6, LPDDR4x/5x, DDR4/5, 200/400/800 GbE.
Experience with long PCB/cable topologies (0.35 – 1.5 meter), signal integrity, and compliance with current standards.
Ability to debug at packet/protocol level across link, transport, transaction, and command layers.
Memory & Clocking
Experience with LPDDR4x memory technologies, DIMM layout and validation.
Expertise in clock distribution, power distribution, SMBus, PMBus, SPI, PWM/Tach, and BMC integration.
Tools & Collaboration
Proficient in schematic capture and PCB layout tools (Cadence Allegro, Mentor Expedition).
Experience with circuit simulation tools (SPICE), signal/power integrity analysis.
Skilled in using lab equipment: oscilloscopes, logic analyzers, JTAG, SMBus, serial debuggers.
Strong collaboration with ODMs on joint designs, schematic/layout reviews, and compliance to Qualcomm design guidelines.
Firmware & Software
Good understanding of x86 firmware/software stack and firmware architecture.
Experience with BMC hardware/software integration and management.
Compliance & Testing
Familiarity with regulatory, environmental, and compliance testing for rack‑level systems.
Preferred Qualifications
Master’s Degree in Electrical and Electronic Engineering, Computer Engineering, or related field.
10+ years hardware engineering / systems development experience.
4+ years experience with circuit design (digital, analog, RF).
4+ years experience utilizing schematic capture and circuit simulation software.
4+ years experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, debug tools.
Minimum Qualifications
Bachelor’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering experience.
OR Master’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering experience.
OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering experience.
EEO and Accessibility Statement Qualcomm is an equal‑opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process. Contact disability‑accomodations@qualcomm.com or call Qualcomm’s toll‑free number found here. Qualcomm will provide reasonable accommodations upon request.
To all staffing and recruiting agencies: Our careers site is only for individuals seeking a job at Qualcomm. The site does not accept unsolicited resumes or applications from agencies. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
Qualcomm expects employees to abide by all applicable policies and procedures, including security and confidentiality requirements, to the extent those are permissible under applicable law.
Pay Range and Other Compensation & Benefits $162,600.00 – $244,000.00. The above pay scale reflects the broad, minimum to maximum pay range for this role. Salary is only one component of total compensation. Qualcomm offers a competitive discretionary bonus program, RSU grants, and a highly competitive benefits package designed to support success at work, at home, and at play. Please contact Qualcomm Careers for more details.
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