Northrop Grumman
Principal / Sr. Principal RF Microwave Design Engineer - R10213250
Northrop Grumman, Linthicum, Maryland, United States
Principal / Sr. Principal RF Microwave Design Engineer - R10213250
Location: Linthicum, MD
Pay: $105,400.00/yr - $196,700.00/yr
Relocation Assistance: No relocation assistance available
Clearance: Secret
Travel: Yes, 10% of the time
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people’s lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation’s history—from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work, and we have an insatiable drive to do what others think is impossible.
Responsibilities
Designing, modeling, and verifying RF/microwave and mixed signal CCAs
Utilize analysis, simulations and prototyping to develop CCA designs
Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques
Contingent role awaiting program award and funding with anticipated start date of Jan 2026.
Role is on-site.
Basic Qualifications
Principal RF Microwave Design Engineer: Bachelor Degree in Electrical Engineering or comparable STEM degree minimum of 5 years of relevant engineering experience (3 years with MS degree; or 0 years with PhD)
Sr. principal RF Microwave Design Engineer: Bachelor Degree in Electrical Engineering or comparable STEM degree minimum of 8 years of relevant engineering experience (6+ years with MS degree; or 3+ years with PhD)
Expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)
RF budgeting, frequency planning, RF chain analysis and modeling
Proficient in RF/Microwave and mixed signal circuit design, schematic capture, and PWB/board layout
Completed and/or led multiple board designs from schematic capture to board release
Demonstrated ability to analyze and troubleshoot RF subsystems, complex mixed-signal ECAs and RF modules using schematics, component design documents, and basic lab test equipment
Design, create, and modify Electrical Ground Support Equipment (EGSE) to support I&T activities
Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty
Demonstrated Technical Team Leadership and ability to work on multi‑discipline engineering teams and communicate clearly within integrated product team leads
Easily adapt to design challenges to meet program goals and deadlines
US Citizenship is required
MUST have active Secret clearance at time of application with the ability to obtain and maintain a TS/SCI w/Poly to meet business needs
Preferred Qualifications
Active Top Secret / SCI security clearance
Experience in Worst Case Circuit Analysis (WCCA) including logic compatibility, component derating, timing analysis, signal and power integrity analyses
Signal integrity analysis (SERDES, Bit error rates, jitter components and contributors, board to board analysis)
Expertise in working with receiver/exciters, conducting RF performance analysis, and implementing digital beamforming
High‑speed digital circuit design experience
Familiarity with Point of Load (PoL) design
Experience in integrating FPGA/Digital controls on the bench (no VHDL experience required)
Understanding of basic signal processing
RF budgeting, frequency planning, RF chain analysis and modeling
Component selection and/or custom component requirements flow down and trades
Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
Integrated Circuit packaging techniques including chip‑and‑wire, QFN, flip‑chip
Product life cycle support from concept through production support
Designing for high reliability, space requirements and environments
AESA / phased array, Radar, SIGINT, or SATCOM experience
Primary Level Salary Range: $105,400.00 - $158,000.00
Secondary Level Salary Range: $131,100.00 - $196,700.00
Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, company paid holidays and paid time off (PTO) for vacation and/or personal business.
Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
Seniority Level: Mid‑Senior level
Employment Type: Full‑time
Job Function: Engineering and Information Technology
Industries: Defense and Space Manufacturing
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Pay: $105,400.00/yr - $196,700.00/yr
Relocation Assistance: No relocation assistance available
Clearance: Secret
Travel: Yes, 10% of the time
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people’s lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation’s history—from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work, and we have an insatiable drive to do what others think is impossible.
Responsibilities
Designing, modeling, and verifying RF/microwave and mixed signal CCAs
Utilize analysis, simulations and prototyping to develop CCA designs
Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques
Contingent role awaiting program award and funding with anticipated start date of Jan 2026.
Role is on-site.
Basic Qualifications
Principal RF Microwave Design Engineer: Bachelor Degree in Electrical Engineering or comparable STEM degree minimum of 5 years of relevant engineering experience (3 years with MS degree; or 0 years with PhD)
Sr. principal RF Microwave Design Engineer: Bachelor Degree in Electrical Engineering or comparable STEM degree minimum of 8 years of relevant engineering experience (6+ years with MS degree; or 3+ years with PhD)
Expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)
RF budgeting, frequency planning, RF chain analysis and modeling
Proficient in RF/Microwave and mixed signal circuit design, schematic capture, and PWB/board layout
Completed and/or led multiple board designs from schematic capture to board release
Demonstrated ability to analyze and troubleshoot RF subsystems, complex mixed-signal ECAs and RF modules using schematics, component design documents, and basic lab test equipment
Design, create, and modify Electrical Ground Support Equipment (EGSE) to support I&T activities
Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty
Demonstrated Technical Team Leadership and ability to work on multi‑discipline engineering teams and communicate clearly within integrated product team leads
Easily adapt to design challenges to meet program goals and deadlines
US Citizenship is required
MUST have active Secret clearance at time of application with the ability to obtain and maintain a TS/SCI w/Poly to meet business needs
Preferred Qualifications
Active Top Secret / SCI security clearance
Experience in Worst Case Circuit Analysis (WCCA) including logic compatibility, component derating, timing analysis, signal and power integrity analyses
Signal integrity analysis (SERDES, Bit error rates, jitter components and contributors, board to board analysis)
Expertise in working with receiver/exciters, conducting RF performance analysis, and implementing digital beamforming
High‑speed digital circuit design experience
Familiarity with Point of Load (PoL) design
Experience in integrating FPGA/Digital controls on the bench (no VHDL experience required)
Understanding of basic signal processing
RF budgeting, frequency planning, RF chain analysis and modeling
Component selection and/or custom component requirements flow down and trades
Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
Integrated Circuit packaging techniques including chip‑and‑wire, QFN, flip‑chip
Product life cycle support from concept through production support
Designing for high reliability, space requirements and environments
AESA / phased array, Radar, SIGINT, or SATCOM experience
Primary Level Salary Range: $105,400.00 - $158,000.00
Secondary Level Salary Range: $131,100.00 - $196,700.00
Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, company paid holidays and paid time off (PTO) for vacation and/or personal business.
Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
Seniority Level: Mid‑Senior level
Employment Type: Full‑time
Job Function: Engineering and Information Technology
Industries: Defense and Space Manufacturing
#J-18808-Ljbffr