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OpenLight

Silicon Photonics Process Integration Engineer

OpenLight, California, Missouri, United States, 65018

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Silicon Photonics Process Integration Engineer This range is provided by OpenLight. Your actual pay will be based on your skills and experience — talk with your recruiter to learn more.

Base pay range $121,500.00/yr - $200,000.00/yr

Additional compensation types Stock options

Direct message the job poster from OpenLight

Company Overview OpenLight Photonics is an innovative start‑up at the forefront of photonic integration, commercializing our cutting‑edge heterogeneously integrated silicon photonics platform. OpenLight has a PDK that supports customers designing Photonic ASICs (PASICs) for applications in communications, LIDAR, quantum computing, sensing, and more. OpenLight has over 300 patents covering the integration of many different active and passive components, such as tunable lasers, DFBs, SOAs, modulators, switches, filters, and detectors, onto a single, silicon photonics chip. Join us in an exciting start‑up environment with ample opportunities for growth and professional development.

Position Summary We are looking for a candidate who will be an integral member of the OpenLight foundry and process team with key responsibilities covering the technical management of the heterogeneous silicon‑IIIV photonic wafer process. The candidate will work closely with external foundry partners, including silicon front‑end processing, heterogeneous wafer bonding, IIIV post‑bond wafer processing, and backend wafer processing (e.g., wafer bumping and singulation), to manage fabrication lots, implement associated control plans, and assure the process meets high‑volume manufacturing standards. The successful candidate will thrive in a high‑pace development environment and enjoy working cross‑functionally with external foundry partners, internal device designers, photonic integrated circuit architects, layout engineers and program managers.

Responsibilities

End‑to‑end fabrication lot management, including creating detailed fabrication plans, participating in mask layout reviews for DfM, leading process reviews with all external foundries, and real‑time monitoring of fabrication lot progress to successful completion.

Collect, analyze and summarize statistical electrical and optical process control monitor (PCM) and in‑line process metrology data and images, including correlation and yield analysis.

Track process issues, work closely with external foundries to resolve issues in a timely manner, and drive process failure analysis with external failure analysis labs and with internal stakeholders. Collaborate closely with internal teams to identify device yield limiting factors and drive failure analysis.

Implement control plans and process specifications to assure a manufacturable process and meet product requirements.

Assist in the development of new process modules as required for OpenLight’s process design kit (PDK) and product roadmap.

Skills and Preferred Experience

Ph.D. Degree in Electrical Engineering, Applied Material Science, Applied Physics or related discipline, or M.S. degree with 2‑5 years of relevant professional experience.

In‑depth understanding and hands‑on experience of silicon photonic wafer process development and manufacturing including photolithography, plasma etching techniques, planarization & metallization.

In‑depth understanding and hands‑on experience of IIIV or heterogeneous/hybrid Si‑IIIV process development and manufacturing.

Experience with semiconductor metrology techniques – ellipsometry, profilometry, SEM, TEM, AFM. Self‑ability to perform metrology in a cleanroom environment is a plus.

Expertise in IC wafer processing failure analysis techniques.

Solid understanding of statistical processes and analysis.

Hands‑on experience with optical or electronic PCM and device data analysis.

Experience with AI‑based data and image analysis is a plus.

Experience with PDK and development is a plus.

Strong technical leadership and an independent thinker.

Very strong problem‑solving, communication, organizational, interpersonal, and presentation skills.

Seniority level Associate

Employment type Full‑time

Job function Engineering and Design

Industries Semiconductor Manufacturing

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