Broadcom
Job Description:
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You will fit this role if:
You are an expert in full-chip power integrity analysis using state of the art tools that are able to parallel process multi-billion node count designs in advanced FinFET process technologies
You have demonstrated solving power integrity problems for a variety of products including 2.5D, spanning from small die with high impedance challenges to massively large chips with large power consumption and significant step load challenges
You have also been involved with helping customers solve voltage budget constraints at the system level through PDN simulations
More specifically we are looking for a chip power integrity expert with the following hands-on know-how:
Developed innovative full-chip power integrity methodologies and flows to handle large node count designs
Developed innovative power integrity methodologies to analyze and sign-off 2.5D and 3D designs
Demonstrated ability to analyze and solve chip power delivery issues/challenges and provide feedback to block owners
Created abstracted macro models for special macros / cells
Performed power delivery network analysis using HSPICE or ADS
In-depth knowledge of Redhawk-SC tool is preferred
Know-how in Totem flow and CMM model creation is nice to have
Familiarity with entire VLSI design flow and tools (Cadence/Synopsys/Mentor) and scripting languages (Tcl, Python)
Will need to be a motivated self-starter and at ease with finding your way around the organization and across organizations within Broadcom.
Education and Experience required: · BS in Electrical Engineering and 12+ years related experience or
· MS in Electrical Engineering and 10+ years related experience
Additional Job Description: Compensation and Benefits The annual base salary range for this position is $141,300 - $226,000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
#J-18808-Ljbffr
1. If you are a first time user, please create your candidatelogin account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
You will fit this role if:
You are an expert in full-chip power integrity analysis using state of the art tools that are able to parallel process multi-billion node count designs in advanced FinFET process technologies
You have demonstrated solving power integrity problems for a variety of products including 2.5D, spanning from small die with high impedance challenges to massively large chips with large power consumption and significant step load challenges
You have also been involved with helping customers solve voltage budget constraints at the system level through PDN simulations
More specifically we are looking for a chip power integrity expert with the following hands-on know-how:
Developed innovative full-chip power integrity methodologies and flows to handle large node count designs
Developed innovative power integrity methodologies to analyze and sign-off 2.5D and 3D designs
Demonstrated ability to analyze and solve chip power delivery issues/challenges and provide feedback to block owners
Created abstracted macro models for special macros / cells
Performed power delivery network analysis using HSPICE or ADS
In-depth knowledge of Redhawk-SC tool is preferred
Know-how in Totem flow and CMM model creation is nice to have
Familiarity with entire VLSI design flow and tools (Cadence/Synopsys/Mentor) and scripting languages (Tcl, Python)
Will need to be a motivated self-starter and at ease with finding your way around the organization and across organizations within Broadcom.
Education and Experience required: · BS in Electrical Engineering and 12+ years related experience or
· MS in Electrical Engineering and 10+ years related experience
Additional Job Description: Compensation and Benefits The annual base salary range for this position is $141,300 - $226,000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
#J-18808-Ljbffr