GPD Optoelectronics Corp.
Wafer Fab Processing Operator (Photonics)
GPD Optoelectronics Corp., Salem, New Hampshire, us, 03079
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Wafer Fab Processing Operator (Photonics)
role at
GPD Optoelectronics Corp.
Are you looking to join a team that influences the future in optics and more? Are you seeking an opportunity to take on interesting tasks and challenging projects? Each of our team members brings a unique view and skill set, and we pride ourselves in being the brightest minds in optics.
GPD Optoelectronics Corp. is seeking a Wafer Processing Operator, a production position involving wafer processing functions of dicing, scribing, testing, and certifying wafer lots at the back end of wafer fabrication. The role requires tactile skill, handling fragile parts, and maintaining proper process conditions.
Additional responsibilities may include use of chemicals and handling wafers in operations such as photolithography, etch, PECVD, metallization, and wafer back grinding.
This full‑time, non‑exempt role is located in Salem, NH and reports to the Senior Wafer Fabrication Engineering Manager.
Essential Functions
Daily operations including wafer thinning, metallization, dicing/scribing, grinding, wafer probe, pick‑and‑place, and device testing.
Fabrication and back‑end testing of InGaAs and Germanium photodiodes, including other substrate materials.
Use of a computer for testing, work‑order entry, and quality details.
Maintaining lot traceability through back‑end operations.
Manual handling of fragile parts.
Reporting problems or issues with supporting daily plans and carrying out priorities as assigned.
Compliance with GPD’s quality policies.
Other tasks as assigned.
Skills & Abilities
Attention to detail and good manual dexterity for handling fragile substrates with tweezers.
Process safety awareness, chemical handling, use of PPE, and regulatory compliance.
Microelectronics or photonic device inspection experience a plus.
Ability to follow MIL‑STD requirements, cleanroom protocol, and product specifications.
Education, Requirements, and Experience
High School Diploma (or GED or equivalence).
Experience processing group III‑V and IV semiconductors.
Ability to identify, multi‑task, and resolve multiple priority issues quickly.
Detail-oriented approach to tasks.
Team collaboration across functions.
LEAN or Six Sigma experience desirable.
Able to lift up to 25 lbs.
Salary commensurate with experience.
Requirements: Must wear complete fab attire for an entire shift and meet all safety and cleanroom requirements (hand hygiene, gowning, shoe covers, masks, gloves, etc.).
Eligible applicants are welcome to apply.
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Wafer Fab Processing Operator (Photonics)
role at
GPD Optoelectronics Corp.
Are you looking to join a team that influences the future in optics and more? Are you seeking an opportunity to take on interesting tasks and challenging projects? Each of our team members brings a unique view and skill set, and we pride ourselves in being the brightest minds in optics.
GPD Optoelectronics Corp. is seeking a Wafer Processing Operator, a production position involving wafer processing functions of dicing, scribing, testing, and certifying wafer lots at the back end of wafer fabrication. The role requires tactile skill, handling fragile parts, and maintaining proper process conditions.
Additional responsibilities may include use of chemicals and handling wafers in operations such as photolithography, etch, PECVD, metallization, and wafer back grinding.
This full‑time, non‑exempt role is located in Salem, NH and reports to the Senior Wafer Fabrication Engineering Manager.
Essential Functions
Daily operations including wafer thinning, metallization, dicing/scribing, grinding, wafer probe, pick‑and‑place, and device testing.
Fabrication and back‑end testing of InGaAs and Germanium photodiodes, including other substrate materials.
Use of a computer for testing, work‑order entry, and quality details.
Maintaining lot traceability through back‑end operations.
Manual handling of fragile parts.
Reporting problems or issues with supporting daily plans and carrying out priorities as assigned.
Compliance with GPD’s quality policies.
Other tasks as assigned.
Skills & Abilities
Attention to detail and good manual dexterity for handling fragile substrates with tweezers.
Process safety awareness, chemical handling, use of PPE, and regulatory compliance.
Microelectronics or photonic device inspection experience a plus.
Ability to follow MIL‑STD requirements, cleanroom protocol, and product specifications.
Education, Requirements, and Experience
High School Diploma (or GED or equivalence).
Experience processing group III‑V and IV semiconductors.
Ability to identify, multi‑task, and resolve multiple priority issues quickly.
Detail-oriented approach to tasks.
Team collaboration across functions.
LEAN or Six Sigma experience desirable.
Able to lift up to 25 lbs.
Salary commensurate with experience.
Requirements: Must wear complete fab attire for an entire shift and meet all safety and cleanroom requirements (hand hygiene, gowning, shoe covers, masks, gloves, etc.).
Eligible applicants are welcome to apply.
#J-18808-Ljbffr