Massachusetts Institute of Technology
Nanofabrication Process Engineer
Massachusetts Institute of Technology, Lexington, Massachusetts, United States, 02173
Overview
The mission of the Quantum-Enabled Computation Group is to explore, prototype, and demonstrate transformative computational advantage by leveraging quantized and entangled signals. Our work falls into three key thrusts: quantum computing with superconducting qubits, classical computing with single flux quanta in superconducting circuits, and quantum information science and algorithms. We also enable the broader US research enterprise via superconducting device foundries and open-source software development, and support the US Government as strategic Test and Evaluation partners and subject matter experts. Our interdisciplinary group includes scientific experts in computer science, quantum information, device theory, materials science, fabrication and integration engineering, electrical and microwave engineering, and quantum physics. Responsibilities
Initiate and execute short-loop and full-flow fabrication runs Oversee standard process runs to meet program needs and improve device performance, yield, and reliability Analyze test structures and metrology data at ambient and cryogenic temperatures Develop processes for new or improved features After training, design data-driven experiments and complete independent tasks while working with a team of engineers and scientists across a range of skill and experience levels Work with materials used for superconducting circuits leveraging back end of line CMOS techniques including metal deposition, photolithography, and etch Collaborate with candidates from diverse backgrounds, including those without direct experience in quantum devices Qualifications
Required: Education: MS in a field related to nanofabrication with at least 3 years of hands-on experience in micro/nanofabrication process engineering or process integration; a B.S. with at least 5 years of hands-on experience or extensive on-the-job experience and demonstrated breadth and depth of fabrication expertise will be considered in lieu of an MS A demonstrated ability to develop and execute rigorous experimental plans Tool operation expertise and theoretical understanding in at least one of lithography, etch, thin films, metrology, and inspection Excellent data management, organization, and communication skills Desired
Tool operation expertise and theoretical understanding across multiple of lithography, etch, thin films, metrology, and inspection Demonstrated skill in electron-beam lithography Expertise across full device fabrication flows Experience with developing and executing standard process control Demonstrated process integration and 3D integration experience and expertise Familiarity with statistical analysis software in general, or JMP specifically Benefits
MIT Lincoln Laboratory offers a range of benefits to support health, well-being, and work-life balance, including: Comprehensive health, dental, and vision plans MIT-funded pension Matching 401K Paid leave (including vacation, sick, parental, military, etc.) Tuition reimbursement and continuing education programs Mentorship programs A range of work-life balance options Other voluntary benefits, discounts and perks For more information, please visit the Benefits page. As an employee of MIT, you can also take advantage of other voluntary benefits, discounts and perks. Security and Equal Opportunity
Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance. MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.
#J-18808-Ljbffr
The mission of the Quantum-Enabled Computation Group is to explore, prototype, and demonstrate transformative computational advantage by leveraging quantized and entangled signals. Our work falls into three key thrusts: quantum computing with superconducting qubits, classical computing with single flux quanta in superconducting circuits, and quantum information science and algorithms. We also enable the broader US research enterprise via superconducting device foundries and open-source software development, and support the US Government as strategic Test and Evaluation partners and subject matter experts. Our interdisciplinary group includes scientific experts in computer science, quantum information, device theory, materials science, fabrication and integration engineering, electrical and microwave engineering, and quantum physics. Responsibilities
Initiate and execute short-loop and full-flow fabrication runs Oversee standard process runs to meet program needs and improve device performance, yield, and reliability Analyze test structures and metrology data at ambient and cryogenic temperatures Develop processes for new or improved features After training, design data-driven experiments and complete independent tasks while working with a team of engineers and scientists across a range of skill and experience levels Work with materials used for superconducting circuits leveraging back end of line CMOS techniques including metal deposition, photolithography, and etch Collaborate with candidates from diverse backgrounds, including those without direct experience in quantum devices Qualifications
Required: Education: MS in a field related to nanofabrication with at least 3 years of hands-on experience in micro/nanofabrication process engineering or process integration; a B.S. with at least 5 years of hands-on experience or extensive on-the-job experience and demonstrated breadth and depth of fabrication expertise will be considered in lieu of an MS A demonstrated ability to develop and execute rigorous experimental plans Tool operation expertise and theoretical understanding in at least one of lithography, etch, thin films, metrology, and inspection Excellent data management, organization, and communication skills Desired
Tool operation expertise and theoretical understanding across multiple of lithography, etch, thin films, metrology, and inspection Demonstrated skill in electron-beam lithography Expertise across full device fabrication flows Experience with developing and executing standard process control Demonstrated process integration and 3D integration experience and expertise Familiarity with statistical analysis software in general, or JMP specifically Benefits
MIT Lincoln Laboratory offers a range of benefits to support health, well-being, and work-life balance, including: Comprehensive health, dental, and vision plans MIT-funded pension Matching 401K Paid leave (including vacation, sick, parental, military, etc.) Tuition reimbursement and continuing education programs Mentorship programs A range of work-life balance options Other voluntary benefits, discounts and perks For more information, please visit the Benefits page. As an employee of MIT, you can also take advantage of other voluntary benefits, discounts and perks. Security and Equal Opportunity
Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance. MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.
#J-18808-Ljbffr