CesiumAstro
Principal Mechanical Design Engineer II
Join our space innovation team at CesiumAstro as a Principal Mechanical Design Engineer II. In this role, you will lead the mechanical design of satellite, UAV, and launch vehicle systems from concept through in‑orbit support, ensuring performance, manufacturability, and environmental qualification. Key Responsibilities Lead mechanical design, detailing, and simulation for all product phases. Develop thermal management, vibration, shock, electromagnetic interference/compatibility (EMI/EMC), and geometrical dimensioning & tolerancing (GD&T) solutions. Coordinate with electrical engineers to integrate electronics packaging and assemblies. Prepare design review materials for customers and executive teams. Support proposal writing and cost analysis for new projects. Mentor junior engineers and provide technical leadership. Required Qualifications Bachelor of Science (BS) or Master of Science (MS) in Mechanical or Aerospace Engineering. 11 years of industry experience in electronics packaging design and analysis; or 9 years with a Master’s degree. Expertise in aerospace industry design, development, and qualification. Proficiency with SolidWorks Simulation, FEA, CNC manufacturing, and thermal analysis tools. Strong written and verbal communication skills. Salary and Benefits Competitive compensation ranging from $151,200 to $189,000 a year, supplemented by stock options, health, dental, vision, HSA, FSA, life, disability, and retirement plans. CesiumAstro is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, veteran status, or any other characteristic protected by law.
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Join our space innovation team at CesiumAstro as a Principal Mechanical Design Engineer II. In this role, you will lead the mechanical design of satellite, UAV, and launch vehicle systems from concept through in‑orbit support, ensuring performance, manufacturability, and environmental qualification. Key Responsibilities Lead mechanical design, detailing, and simulation for all product phases. Develop thermal management, vibration, shock, electromagnetic interference/compatibility (EMI/EMC), and geometrical dimensioning & tolerancing (GD&T) solutions. Coordinate with electrical engineers to integrate electronics packaging and assemblies. Prepare design review materials for customers and executive teams. Support proposal writing and cost analysis for new projects. Mentor junior engineers and provide technical leadership. Required Qualifications Bachelor of Science (BS) or Master of Science (MS) in Mechanical or Aerospace Engineering. 11 years of industry experience in electronics packaging design and analysis; or 9 years with a Master’s degree. Expertise in aerospace industry design, development, and qualification. Proficiency with SolidWorks Simulation, FEA, CNC manufacturing, and thermal analysis tools. Strong written and verbal communication skills. Salary and Benefits Competitive compensation ranging from $151,200 to $189,000 a year, supplemented by stock options, health, dental, vision, HSA, FSA, life, disability, and retirement plans. CesiumAstro is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, veteran status, or any other characteristic protected by law.
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