Apple Inc.
Santa Clara, California, United States
Description Responsible for leading Si photonics packaging technology development. Collaborate with cross-functional teams to lead optical engine module and co-packaging optics development efforts. Design Si photonics-based optical engine package architecture, package integration, and drive micro-optical component assembly/interface characterization through innovation. Work with foundry and OSAT to bring Si photonics packaging solutions from concept to high-volume manufacturing (HVM).
Minimum 5% international travel required.
Minimum Qualifications
Bachelor's degree and 10+ years of relevant industry experience
Preferred Qualifications
M.S. or Ph.D. in Physics (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering, or an equivalent field
Excellent teamwork and communication skills
Strong theoretical background in optics and photonics fundamentals, device/module integration
Hands-on experience in photonic IC (PIC) design, silicon photonics devices such as lasers, high-speed modulators, photodiodes, passive components like Si waveguides, MUX/DeMUX
Experience in Si photonics packaging and fiber-coupled device measurement
Experience in optical component design, simulation, qualification, and fiber assembly using active/passive alignment tools; CMOS BEOL wafer processing and flip chip assembly (CoC, CoW, WLP)
Note: This job posting is active and accepting applications.
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Description Responsible for leading Si photonics packaging technology development. Collaborate with cross-functional teams to lead optical engine module and co-packaging optics development efforts. Design Si photonics-based optical engine package architecture, package integration, and drive micro-optical component assembly/interface characterization through innovation. Work with foundry and OSAT to bring Si photonics packaging solutions from concept to high-volume manufacturing (HVM).
Minimum 5% international travel required.
Minimum Qualifications
Bachelor's degree and 10+ years of relevant industry experience
Preferred Qualifications
M.S. or Ph.D. in Physics (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering, or an equivalent field
Excellent teamwork and communication skills
Strong theoretical background in optics and photonics fundamentals, device/module integration
Hands-on experience in photonic IC (PIC) design, silicon photonics devices such as lasers, high-speed modulators, photodiodes, passive components like Si waveguides, MUX/DeMUX
Experience in Si photonics packaging and fiber-coupled device measurement
Experience in optical component design, simulation, qualification, and fiber assembly using active/passive alignment tools; CMOS BEOL wafer processing and flip chip assembly (CoC, CoW, WLP)
Note: This job posting is active and accepting applications.
#J-18808-Ljbffr