Cadence
Principal Thermal Mechanical Engineer (R48164/dh)
Cadence, San Jose, California, United States, 95199
Principal Thermal Mechanical Engineer (R48164/dh)
Location: San Jose, CA. This role reports to the Mechanical Engineering Director and works in a talented organization.
Base pay range $175,000.00/yr – $195,000.00/yr
Additional compensation types Annual Bonus and RSUs
Key responsibilities
Perform component and system thermal analysis.
Design thermal solutions for air‑cooled and liquid‑cooled products.
Perform thermal testing and provide thermal assessment/recommendations.
Specify thermal and mechanical components.
Design mechanical components and platform enclosures.
Perform circuit board layouts and placement of electronic components on circuit boards.
Draft 2D drawings of circuit board layouts, mechanical components, and system assemblies.
Structure BOMs and generate ECRs to release products to PDM.
Work with suppliers/manufacturers to address DFM feedback.
Perform inspection of materials and resolve quality issues.
Perform some hand‑on works (prototype build, mechanical assembling, cable routing…).
Qualifications
BS or degree in mechanical engineering with a minimum of 10 years of experience OR MS with a minimum of 7 years of experience OR PhD with a minimum of 5 years of experience.
Experienced in thermal and mechanical design of equipment designed to operate in data centers.
Experienced with thermal analysis and thermal simulation tools (CFD).
Experienced with air and liquid cooling design, and thermal testing.
Experienced designing circuit board layouts, sheet metal parts and mechanical components.
Proficient in using mechanical CAD software. Experience with Creo Elements/Direct is a plus.
Familiar with BOM structuring and ECO processes. PTC Arena (PDM) experience is a plus.
Experience with GD&T is a plus.
Experience using hand tools and operating machining equipment is a plus.
Good cross‑functional communications, strong work ethic, and great team‑work attitude.
Seniority level Mid‑Senior level
Employment type Full‑time
Job function Engineering and Information Technology
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Base pay range $175,000.00/yr – $195,000.00/yr
Additional compensation types Annual Bonus and RSUs
Key responsibilities
Perform component and system thermal analysis.
Design thermal solutions for air‑cooled and liquid‑cooled products.
Perform thermal testing and provide thermal assessment/recommendations.
Specify thermal and mechanical components.
Design mechanical components and platform enclosures.
Perform circuit board layouts and placement of electronic components on circuit boards.
Draft 2D drawings of circuit board layouts, mechanical components, and system assemblies.
Structure BOMs and generate ECRs to release products to PDM.
Work with suppliers/manufacturers to address DFM feedback.
Perform inspection of materials and resolve quality issues.
Perform some hand‑on works (prototype build, mechanical assembling, cable routing…).
Qualifications
BS or degree in mechanical engineering with a minimum of 10 years of experience OR MS with a minimum of 7 years of experience OR PhD with a minimum of 5 years of experience.
Experienced in thermal and mechanical design of equipment designed to operate in data centers.
Experienced with thermal analysis and thermal simulation tools (CFD).
Experienced with air and liquid cooling design, and thermal testing.
Experienced designing circuit board layouts, sheet metal parts and mechanical components.
Proficient in using mechanical CAD software. Experience with Creo Elements/Direct is a plus.
Familiar with BOM structuring and ECO processes. PTC Arena (PDM) experience is a plus.
Experience with GD&T is a plus.
Experience using hand tools and operating machining equipment is a plus.
Good cross‑functional communications, strong work ethic, and great team‑work attitude.
Seniority level Mid‑Senior level
Employment type Full‑time
Job function Engineering and Information Technology
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