Lumentum
Responsible for designing, developing, and testing high-speed electrical circuits and interfaces for co-packaged optical modules, which integrate optical components directly onto the same substrate as electrical chips. This role requires expertise in high-speed digital and analog circuit design, signal integrity, power delivery, and PCB design, as well as a strong understanding of optical communication principles.
Key Responsibilities
Work with external design house to design and develop Si/organic RDL interposer. Design and layout high-speed PCBs for co-packaged optics modules and EVB, considering signal integrity, power delivery, and thermal management requirements. Perform signal integrity analysis and simulation to ensure optimal signal transmission and minimize signal degradation in high-speed links. Design and optimize the power delivery network for co-packaged optics modules to ensure stable and reliable power delivery to all components. Select appropriate electrical components, including connectors, cables, and ICs, for co-packaged optics modules. Develop test plans and procedures to validate the performance of co-packaged optics modules, including high-speed electrical interfaces, power delivery, and thermal management. Collaborate with optical engineers, mechanical engineers, and other cross-functional teams to integrate electrical and optical components into a cohesive system. Qualifications
Ph.D in Electrical Engineering/Physics/Applied Physics with 3+ years’ experience Strong foundation in digital, analog, and high-speed circuit design, simulation, and verification Laboratory experience with high-speed optical and electrical test equipment Proven track record with new product introductions and product ramp Knowledgeable of high-speed optoelectronic devices (e.g. lasers, detectors, modulators) Multi-disciplinary background with a demonstrated record of innovation Excellent communication, organizational and time management skills Seniority Level
Mid-Senior level Employment Type
Full-time Job Function
Engineering and Design Industries
Telecommunications and Semiconductor Manufacturing
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Work with external design house to design and develop Si/organic RDL interposer. Design and layout high-speed PCBs for co-packaged optics modules and EVB, considering signal integrity, power delivery, and thermal management requirements. Perform signal integrity analysis and simulation to ensure optimal signal transmission and minimize signal degradation in high-speed links. Design and optimize the power delivery network for co-packaged optics modules to ensure stable and reliable power delivery to all components. Select appropriate electrical components, including connectors, cables, and ICs, for co-packaged optics modules. Develop test plans and procedures to validate the performance of co-packaged optics modules, including high-speed electrical interfaces, power delivery, and thermal management. Collaborate with optical engineers, mechanical engineers, and other cross-functional teams to integrate electrical and optical components into a cohesive system. Qualifications
Ph.D in Electrical Engineering/Physics/Applied Physics with 3+ years’ experience Strong foundation in digital, analog, and high-speed circuit design, simulation, and verification Laboratory experience with high-speed optical and electrical test equipment Proven track record with new product introductions and product ramp Knowledgeable of high-speed optoelectronic devices (e.g. lasers, detectors, modulators) Multi-disciplinary background with a demonstrated record of innovation Excellent communication, organizational and time management skills Seniority Level
Mid-Senior level Employment Type
Full-time Job Function
Engineering and Design Industries
Telecommunications and Semiconductor Manufacturing
#J-18808-Ljbffr