Precision Wire Bonding Specialist: Microelectronics

A leading research institution in Berkeley is seeking a Wire Bonding Specialist to support precision microelectronics assembly. You will perform wire bonding on hybrid circuits and collaborate with engineers and scientists. Candidates should have 4–6 years of applicable experience, with a strong understanding of cleanroom environments and wire bonding techniques. This full-time position offers competitive hourly rates and opportunities for career development. #J-18808-Ljbffr