Micron Technology
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DMTS Product Architect
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Micron Technology Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a CMBU Systems Architecture Engineer at Micron Technology, you will have the opportunity to establish a deep understanding of Micron’s technologies and capabilities, as well as key market trends and competitive landscapes. You will be responsible for using that knowledge to define optimized memory and storage solutions for AI training and inference. You will build strong technical relationships with system architects and key technologists across the industry and represent Micron at technical conferences and consortia. Internally, you will partner with Micron’s top R&D, design, test, and product engineers to ensure successful implementation of new product concepts, and work closely with Product and Business Development Managers to align technical decisions with our business strategy, ultimately helping bring outstanding new products to our customers. Responsibilities
Conduct system architecture exploration, analysis, and evaluation using modeling, simulation, and prototyping tools. Collaborate with customers and external partners to identify architecture bottlenecks and propose innovative solutions. Drive pathfinding initiatives for system architectures incorporating LPDDR, DDR, and HBM memory technologies. Explore memory features that enhance DRAM’s value proposition in AI and high‑performance computing applications. Mentor and coach junior system architects and engineers to build technical expertise within the team. Minimum Qualifications
Bachelor’s degree in Electrical Engineering or related field (BSEE or higher). 12+ years of experience in system design and architecture. Strong understanding of memory hierarchy, memory controllers, and PHY design. Familiarity with LPDDR, DDR, and HBM memory technologies and their integration in compute systems. Ability to work independently and collaboratively in a fast‑paced, dynamic environment. Preferred Qualifications
Master’s or Ph.D. in Electrical Engineering, Computer Engineering, or related discipline. Deep knowledge of memory architectures, system memory hierarchy, and compute system architectures. Exposure to packaging technologies such as TSV, stacked packaging, and 3D packaging. Experience with custom SoC/ASIC design and HW/SW co‑optimization. Understanding of JEDEC standards and participation in specification‑setting processes; familiarity with AI frameworks and high‑performance computing applications. The US base salary range that Micron Technology estimates it could pay for this full‑time position is: $177,000.00 – $416,000.00. Additional compensation may include benefits, discretionary bonuses and equity. Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Additional benefit programs protect income if unable to work due to illness or injury, provide paid family leave, robust paid time‑off, and paid holidays. For additional information regarding the benefits programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work, please visit micron.com/careers. For assistance with the application process and/or reasonable accommodations, contact Micron’s People Organization at hrsupport_na@micron.com or 1‑800‑336‑8918 (select option #3).
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DMTS Product Architect
role at
Micron Technology Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a CMBU Systems Architecture Engineer at Micron Technology, you will have the opportunity to establish a deep understanding of Micron’s technologies and capabilities, as well as key market trends and competitive landscapes. You will be responsible for using that knowledge to define optimized memory and storage solutions for AI training and inference. You will build strong technical relationships with system architects and key technologists across the industry and represent Micron at technical conferences and consortia. Internally, you will partner with Micron’s top R&D, design, test, and product engineers to ensure successful implementation of new product concepts, and work closely with Product and Business Development Managers to align technical decisions with our business strategy, ultimately helping bring outstanding new products to our customers. Responsibilities
Conduct system architecture exploration, analysis, and evaluation using modeling, simulation, and prototyping tools. Collaborate with customers and external partners to identify architecture bottlenecks and propose innovative solutions. Drive pathfinding initiatives for system architectures incorporating LPDDR, DDR, and HBM memory technologies. Explore memory features that enhance DRAM’s value proposition in AI and high‑performance computing applications. Mentor and coach junior system architects and engineers to build technical expertise within the team. Minimum Qualifications
Bachelor’s degree in Electrical Engineering or related field (BSEE or higher). 12+ years of experience in system design and architecture. Strong understanding of memory hierarchy, memory controllers, and PHY design. Familiarity with LPDDR, DDR, and HBM memory technologies and their integration in compute systems. Ability to work independently and collaboratively in a fast‑paced, dynamic environment. Preferred Qualifications
Master’s or Ph.D. in Electrical Engineering, Computer Engineering, or related discipline. Deep knowledge of memory architectures, system memory hierarchy, and compute system architectures. Exposure to packaging technologies such as TSV, stacked packaging, and 3D packaging. Experience with custom SoC/ASIC design and HW/SW co‑optimization. Understanding of JEDEC standards and participation in specification‑setting processes; familiarity with AI frameworks and high‑performance computing applications. The US base salary range that Micron Technology estimates it could pay for this full‑time position is: $177,000.00 – $416,000.00. Additional compensation may include benefits, discretionary bonuses and equity. Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Additional benefit programs protect income if unable to work due to illness or injury, provide paid family leave, robust paid time‑off, and paid holidays. For additional information regarding the benefits programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work, please visit micron.com/careers. For assistance with the application process and/or reasonable accommodations, contact Micron’s People Organization at hrsupport_na@micron.com or 1‑800‑336‑8918 (select option #3).
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