Q-Edge Corporation, Foxconn
SMT Process Validation Engineer (A Group MLB PE 02 )-Houston,TX
Q-Edge Corporation, Foxconn, Houston, Texas, United States, 77246
Overview
SMT Process Validation Engineer (A Group MLB PE 02) - Houston,TX Foxconn Technology Group, a globally leading electronics manufacturing company, is hiring an SMT Process Experiment Engineer. Lead reliability test analysis of SMT (surface mounting technology, Consumer Electronics Industry), such as cross section/Dye&pry/shear/pull/torsion/FT-IR etc. Experimental anomaly analysis of SMT process defects, such as void, crack, cold solder using SEM/EDS and optical microscopy, data support for process optimization and quality improvement and collaborate with DFM teams to improve designs based on failure mode data. Develop test methodologies for new materials (low temperature solders, Flex PCBs). Responsibilities
Lead SMT reliability test and analysis: such as cross-section, Dye&pry, shearpulltorsion, FT-IR etc. Prepare SMT reliability test reports. Maintain experimental equipment. Manage and train operation technicians. Optimize reliability test processes and methods to improve efficiency and accuracy. Lead line-qualification of SMT lines and track progress. Education and work experience
Educational Requirements: Bachelor\'s degree or above. Work Experience (Nice-to-Have): Preference is given to those with relevant work experience, and outstanding recent graduates are also eligible to apply. Working conditions
Join a high-growth, innovation-driven team shaping next-gen consumer electronics. Work at the intersection of engineering, automation, and global operations. Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.
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SMT Process Validation Engineer (A Group MLB PE 02) - Houston,TX Foxconn Technology Group, a globally leading electronics manufacturing company, is hiring an SMT Process Experiment Engineer. Lead reliability test analysis of SMT (surface mounting technology, Consumer Electronics Industry), such as cross section/Dye&pry/shear/pull/torsion/FT-IR etc. Experimental anomaly analysis of SMT process defects, such as void, crack, cold solder using SEM/EDS and optical microscopy, data support for process optimization and quality improvement and collaborate with DFM teams to improve designs based on failure mode data. Develop test methodologies for new materials (low temperature solders, Flex PCBs). Responsibilities
Lead SMT reliability test and analysis: such as cross-section, Dye&pry, shearpulltorsion, FT-IR etc. Prepare SMT reliability test reports. Maintain experimental equipment. Manage and train operation technicians. Optimize reliability test processes and methods to improve efficiency and accuracy. Lead line-qualification of SMT lines and track progress. Education and work experience
Educational Requirements: Bachelor\'s degree or above. Work Experience (Nice-to-Have): Preference is given to those with relevant work experience, and outstanding recent graduates are also eligible to apply. Working conditions
Join a high-growth, innovation-driven team shaping next-gen consumer electronics. Work at the intersection of engineering, automation, and global operations. Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.
#J-18808-Ljbffr