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Acceler8 Talent

Senior Mechanical Design Engineer - AI Infrastructure

Acceler8 Talent, San Francisco

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Senior Mechanical Design Engineer - AI Infrastructure

Senior Mechanical Design Engineer - AI Infrastructure

This range is provided by Acceler8 Talent. Your actual pay will be based on your skills and experience — talk with your recruiter to learn more.

Base pay range

$220,000.00/yr - $260,000.00/yr

Additional compensation types

Stock options

Direct message the job poster from Acceler8 Talent

Building North American Photonic and Semiconductor Engineering Teams

Acceler8Talent is proud to partner with a well-funded, VC-backed AI/networking hardware startup in the SF Bay area that’s redefining infrastructure for the world’s largest hyperscalers. Operating under a Joint Development Model (JDM), this company co-develops highly customized networking hardware, software, and optics solutions tailored to the evolving needs of large-scale AI workloads.

With over $110M in funding and rapid expansion underway, they're now looking to hire a Senior Mechanical Design Engineer to help shape the next generation of high-performance systems.

Responsibilities:

Mechanical Design: Develop chassis and line card designs that meet product, reliability, and scalability requirements.

Tolerance Analysis: Conduct 2D/3D tolerance studies for complex electro-mechanical assemblies.

Mechanical Solutions: Design parts using sheet metal, plastic, die-cast, and extrusion processes with attention to EMI, safety, and compliance.

3D Modeling & Documentation: Create CAD models (preferably in Creo), PCB outlines, and detailed drawings; manage BOMs, ECOs, and part numbers.

Cross-Functional Collaboration: Work with hardware, thermal, CAD, and manufacturing teams to align on requirements, solve issues, and manage risks.

Cooling & Supplier Support: Design cooling systems (liquid/forced-air) and coordinate with suppliers to ensure manufacturability.

Cable & Connector Design: Support OSFP/QSFP-DD/OSFP-XD connector and cable harness design for front panels and backplanes.

Qualifications:

  • B.S. or higher in Mechanical Engineering
  • 8+ years of mechanical design experience in telecom or data center hardware

Technical Skills:

  • Proficient in Creo (preferred) and SolidWorks
  • Strong understanding of EIA, ETSI, and OCP rack standards
  • Experience with OSFP/QSFP-DD/OSFP-XD connectors and backplane systems
  • Skilled in tolerancing for complex electro-mechanical assemblies
  • Familiar with NEBS testing and compliance (a plus)

Hands-On Experience:

  • Mechanical design using sheet metal, molding, casting, and extrusion
  • Cable harness and cooling system (liquid/air) design
  • Comfortable with rework tools and mock-up fabrication

Seniority level

  • Seniority level

    Mid-Senior level

Employment type

  • Employment type

    Full-time

Job function

  • Industries

    Semiconductor Manufacturing, Appliances, Electrical, and Electronics Manufacturing, and Telecommunications

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Inferred from the description for this job

Medical insurance

Vision insurance

401(k)

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