Stryker Corporation
Principal Optoelectronic Packaging Engineer
Stryker Corporation, San Diego, California, United States, 92189
Samtec, Inc.
Principal Optoelectronic Packaging Engineer Samtec is seeking an Advanced packaging and process architect to join our team at the Vista Design Center located in Vista, CA. The advanced packaging and process architect is a senior engineering leader responsible for designing, developing, and implementing next‑generation optoelectronic packaging solutions. In this key role as a subject‑matter expert in the development of 2.5D/3D packaging solutions, you’ll be instrumental in harnessing leading‑edge technologies to create Samtec’s next‑generation optical module products.
Essential Functions / Responsibilities
Research & Innovation: Research and analyze emerging material and process technologies within a roadmap connecting capabilities and products.
Architecture Development: Guide the physical architecture of advanced optoelectronic packages based on a broad knowledge of interconnect technologies (RDL, wire bonding, flip chip, solder, conductive adhesives, etc.), materials (semiconductors, glass, laminates, ceramics, polymers, adhesives, etc.), and automated assembly techniques (SMT, wire bonding, die attach, curing, thermal bonding, spot curing, solder reflow, epoxy dispense, etc.).
Process Development: Lead the development and integration of assembly processes in R&D, prototyping, and volume production environments. Apply Six Sigma methodologies (DMADV) and FMEA to design and document new processes. Ensure optical module reliability by conducting necessary testing to meet commercial and military standards.
Process Transfer: Interface with internal and external operations teams, collaborating closely with production teams on equipment and process improvements. Transfer scalable processes to manufacturing operations, both domestic and international.
Mentorship: Mentor process development engineers on DOE (Design of Experiments) techniques, failure analysis, and operation of automated and mechanized equipment to support package builds for low, medium, and high‑volume production.
Collaboration: Work closely with marketing, process engineering, and R&D teams to align goals and realize outcomes.
The responsibilities, as defined, are intended to serve as a general guideline for this position. Associates may be asked to perform additional tasks depending on strengths and capabilities.
Required Experience Experience
15-25 years of experience building optoelectronic packages in a manufacturing environment.
10+ years conducting research on new materials and processes.
10+ years developing processes on automated and semi‑automated equipment.
Direct experience working in a manufacturing environment, including familiarity with cleanroom protocols and equipment.
Technical Expertise
Extensive knowledge of materials, interconnect technologies, equipment, and process development for optoelectronic module assembly.
Deep understanding of automated and mechanized equipment used semiconductor packaging and assembly.
Familiarity with 3D printing using polymers for various applications.
Solid understanding of optical module reliability and testing protocols.
Soft Skills
Strong communication skills: excellent written, verbal, and presentation abilities.
Independent problem‑solver with the ability to work within a multi‑disciplinary engineering environment.
Highly organized with the capacity to manage multiple priorities effectively.
Proficient in Microsoft products with the ability to adapt to new software.
Education BS or MS in Electrical, Materials, Chemical, or Mechanical Engineering or an equivalent degree.
Salary & Benefit Offerings The
preferred location
for this position is the
Samtec Vista Design Center
in
San Diego/Vista, CA . At this site, the salary range is
$187,000 – $212,000 annually , based on experience, plus generous Samtec bonuses paid three times per year (February, August, and late fall).
A
secondary option
is the
Silicon Valley Design Center
in
Santa Clara, CA , where the salary range is
$220,000 – $250,000 annually , based on experience, plus the same bonus structure.
The
third location
is the
Samtec Microelectronics facility
in
Colorado Springs, CO , with a salary range of
$159,000 – $180,000 annually , based on experience, plus bonuses as noted above.
Relocation assistance
is available
only for moves to the preferred location
(San Diego/Vista, CA). Samtec’s generous benefits package includes medical (HSA/PPO), dental, vision, hearing, group life, AD&D, short‑ and long‑term disability, EAP, 401(k) match/profit sharing (Samtec will contribute 7% of your total gross pay to your 401(k) plan regardless of any contributions you make and will match the first 5% of your contribution to the 401(k)-plan dollar for dollar), plus other voluntary options, as well as paid time off.
About Samtec Founded in 1976, Samtec is a privately held, $950 million global manufacturer of a broad line of electronic interconnect solutions, including high‑speed board‑to‑board, high‑speed cables, mid‑board and panel optics, precision RF, flexible stacking, and micro/rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service.
Apply now if you have what it takes and are interested in joining Samtec’s vaunted culture, with competitive salaries and world‑class benefits.
Equal Opportunity Employer SAMTEC, Inc. is an Equal Opportunity Employer and committed to creating a diverse environment. All employment decisions at Samtec are based on business needs, job requirements and individual qualifications, without regard to race, color, religion or belief, national, social or ethnic origin, pregnancy or parental status, age, disability, sexual orientation, gender and/or gender identity/expression, marital status, past or present military service, family medical history or genetic information, or any other status protected by applicable laws.
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Principal Optoelectronic Packaging Engineer Samtec is seeking an Advanced packaging and process architect to join our team at the Vista Design Center located in Vista, CA. The advanced packaging and process architect is a senior engineering leader responsible for designing, developing, and implementing next‑generation optoelectronic packaging solutions. In this key role as a subject‑matter expert in the development of 2.5D/3D packaging solutions, you’ll be instrumental in harnessing leading‑edge technologies to create Samtec’s next‑generation optical module products.
Essential Functions / Responsibilities
Research & Innovation: Research and analyze emerging material and process technologies within a roadmap connecting capabilities and products.
Architecture Development: Guide the physical architecture of advanced optoelectronic packages based on a broad knowledge of interconnect technologies (RDL, wire bonding, flip chip, solder, conductive adhesives, etc.), materials (semiconductors, glass, laminates, ceramics, polymers, adhesives, etc.), and automated assembly techniques (SMT, wire bonding, die attach, curing, thermal bonding, spot curing, solder reflow, epoxy dispense, etc.).
Process Development: Lead the development and integration of assembly processes in R&D, prototyping, and volume production environments. Apply Six Sigma methodologies (DMADV) and FMEA to design and document new processes. Ensure optical module reliability by conducting necessary testing to meet commercial and military standards.
Process Transfer: Interface with internal and external operations teams, collaborating closely with production teams on equipment and process improvements. Transfer scalable processes to manufacturing operations, both domestic and international.
Mentorship: Mentor process development engineers on DOE (Design of Experiments) techniques, failure analysis, and operation of automated and mechanized equipment to support package builds for low, medium, and high‑volume production.
Collaboration: Work closely with marketing, process engineering, and R&D teams to align goals and realize outcomes.
The responsibilities, as defined, are intended to serve as a general guideline for this position. Associates may be asked to perform additional tasks depending on strengths and capabilities.
Required Experience Experience
15-25 years of experience building optoelectronic packages in a manufacturing environment.
10+ years conducting research on new materials and processes.
10+ years developing processes on automated and semi‑automated equipment.
Direct experience working in a manufacturing environment, including familiarity with cleanroom protocols and equipment.
Technical Expertise
Extensive knowledge of materials, interconnect technologies, equipment, and process development for optoelectronic module assembly.
Deep understanding of automated and mechanized equipment used semiconductor packaging and assembly.
Familiarity with 3D printing using polymers for various applications.
Solid understanding of optical module reliability and testing protocols.
Soft Skills
Strong communication skills: excellent written, verbal, and presentation abilities.
Independent problem‑solver with the ability to work within a multi‑disciplinary engineering environment.
Highly organized with the capacity to manage multiple priorities effectively.
Proficient in Microsoft products with the ability to adapt to new software.
Education BS or MS in Electrical, Materials, Chemical, or Mechanical Engineering or an equivalent degree.
Salary & Benefit Offerings The
preferred location
for this position is the
Samtec Vista Design Center
in
San Diego/Vista, CA . At this site, the salary range is
$187,000 – $212,000 annually , based on experience, plus generous Samtec bonuses paid three times per year (February, August, and late fall).
A
secondary option
is the
Silicon Valley Design Center
in
Santa Clara, CA , where the salary range is
$220,000 – $250,000 annually , based on experience, plus the same bonus structure.
The
third location
is the
Samtec Microelectronics facility
in
Colorado Springs, CO , with a salary range of
$159,000 – $180,000 annually , based on experience, plus bonuses as noted above.
Relocation assistance
is available
only for moves to the preferred location
(San Diego/Vista, CA). Samtec’s generous benefits package includes medical (HSA/PPO), dental, vision, hearing, group life, AD&D, short‑ and long‑term disability, EAP, 401(k) match/profit sharing (Samtec will contribute 7% of your total gross pay to your 401(k) plan regardless of any contributions you make and will match the first 5% of your contribution to the 401(k)-plan dollar for dollar), plus other voluntary options, as well as paid time off.
About Samtec Founded in 1976, Samtec is a privately held, $950 million global manufacturer of a broad line of electronic interconnect solutions, including high‑speed board‑to‑board, high‑speed cables, mid‑board and panel optics, precision RF, flexible stacking, and micro/rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service.
Apply now if you have what it takes and are interested in joining Samtec’s vaunted culture, with competitive salaries and world‑class benefits.
Equal Opportunity Employer SAMTEC, Inc. is an Equal Opportunity Employer and committed to creating a diverse environment. All employment decisions at Samtec are based on business needs, job requirements and individual qualifications, without regard to race, color, religion or belief, national, social or ethnic origin, pregnancy or parental status, age, disability, sexual orientation, gender and/or gender identity/expression, marital status, past or present military service, family medical history or genetic information, or any other status protected by applicable laws.
PI280352499
#J-18808-Ljbffr