Senior Optical Packaging Engineer — Fiber-to-Chip Leader

A leading quantum computing company is seeking a Senior Optical Packaging Engineer to develop high-performance optical packaging and scalable processes for fiber-to-chip systems. The ideal candidate will have over 10 years of experience in semiconductor packaging, expertise in optical measurements, and a Master's degree in a relevant field. This role involves collaboration with manufacturing and external vendors to optimize designs and ensure quality and reliability in optical integrated circuits. #J-18808-Ljbffr