Barrington James
My client is seeking a skilled Photonics Engineer with 3–5 years of industry experience to join our integrated photonics team in Austin, TX. You will be involved in the full photonic integrated circuit (PIC) development lifecycle—from component design and simulation, to layout, tapeout, characterization, and packaging. This is a hands‑on role at the heart of our quantum processor development, offering broad exposure to both R&D and product engineering.
Base pay range : $110,000.00/yr - $140,000.00/yr
Key Responsibilities
Design and simulate passive and active photonic components using tools such as Lumerical MODE and FDTD
Create and maintain PIC layouts using OptoDesigner, KLayout, or similar tools
Own tapeout processes and coordinate with foundries or internal teams for fabrication
Develop and maintain test setups for component- and chip-level characterization
Automate testing workflows to increase efficiency, reduce testing time, and improve testing accuracy
Collaborate with quantum research team to define PIC requirements and align photonic development with system-level goals
Work closely with the fabrication team and external manufacturing partners on process integration and performance monitoring
Analyze test data, validate performance, and iterate on design improvements
Maintain thorough documentation and provide regular technical updates to the team and leadership
Support packaging workflows and collaborate with packaging vendors for PIC integration
Contribute to the development of my client’s intellectual property portfolio through patent filings
Engage cross‑functionally with electronics, software, and systems teams to enable scalable, manufacturable quantum products
Required Qualifications
PhD in Photonics, Physics, Electrical Engineering, or a related field
3–5 years of industry experience in photonic integrated circuit development
Proficiency with simulation tools such as Lumerical MODE and FDTD
Experience with layout tools like OptoDesigner or KLayout
Track record of successful tapeouts and photonic device characterization
Familiarity with PIC packaging processes and challenges
Strong written and verbal communication skills for reporting and presentations
Must be based in Austin, TX, with hybrid work flexibility
Preferred Qualifications
Hands‑on experience with Silicon Nitride (SiN) and/or Thin‑Film Lithium Niobate (TFLN) platforms
Background in quantum photonics or quantum optics
Strong experimental skills and ability to troubleshoot optical and electro‑optical systems
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Base pay range : $110,000.00/yr - $140,000.00/yr
Key Responsibilities
Design and simulate passive and active photonic components using tools such as Lumerical MODE and FDTD
Create and maintain PIC layouts using OptoDesigner, KLayout, or similar tools
Own tapeout processes and coordinate with foundries or internal teams for fabrication
Develop and maintain test setups for component- and chip-level characterization
Automate testing workflows to increase efficiency, reduce testing time, and improve testing accuracy
Collaborate with quantum research team to define PIC requirements and align photonic development with system-level goals
Work closely with the fabrication team and external manufacturing partners on process integration and performance monitoring
Analyze test data, validate performance, and iterate on design improvements
Maintain thorough documentation and provide regular technical updates to the team and leadership
Support packaging workflows and collaborate with packaging vendors for PIC integration
Contribute to the development of my client’s intellectual property portfolio through patent filings
Engage cross‑functionally with electronics, software, and systems teams to enable scalable, manufacturable quantum products
Required Qualifications
PhD in Photonics, Physics, Electrical Engineering, or a related field
3–5 years of industry experience in photonic integrated circuit development
Proficiency with simulation tools such as Lumerical MODE and FDTD
Experience with layout tools like OptoDesigner or KLayout
Track record of successful tapeouts and photonic device characterization
Familiarity with PIC packaging processes and challenges
Strong written and verbal communication skills for reporting and presentations
Must be based in Austin, TX, with hybrid work flexibility
Preferred Qualifications
Hands‑on experience with Silicon Nitride (SiN) and/or Thin‑Film Lithium Niobate (TFLN) platforms
Background in quantum photonics or quantum optics
Strong experimental skills and ability to troubleshoot optical and electro‑optical systems
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