Cisco
MEMS Technical Program Manager, Technical Leader
Cisco, Carlsbad, California, United States, 92002
MEMS Technical Program Manager, Technical Leader
Work as part of a world class photonics team on MEMS packaging of optical components and their integration into Cisco’s volume transceiver products.
Cisco has developed a unique high‑volume laser micro‑package platform (LaMP) with MEMS‑wafer fabrication at a Cisco supplier, specialized assembly and test conducted at in‑house tools and processes that provide a unique opportunity for improvements spanning from design to volume production.
This multi‑disciplinary position requires an in‑depth understanding of MEMS fabrication techniques (bulk micro‑machining) as well as more specialized methods for assembly and test of packaged optical components. The ideal candidate will have MEMS production experience for photonic or sensor applications, familiarity with general semiconductor wafer processing processes and tools, and be proficient with advanced data analysis techniques.
Candidates are expected to work closely with Cisco’s suppliers as well as Cisco’s packaging and test teams to maintain and improve yields, performance, and reliability of critical photonics components by applying structured problem‑solving techniques and leveraging advanced data collection methods.
Your Impact
In‑depth monitoring of MEMS supplier production performance and quality
Support suppliers in setting up adequate production monitoring, quality control, problem‑solving, and continuous improvement practices
Conduct failure analysis and physical characterization to root cause process and device failure modes
Lead teams in resolving yield and defectivity issues in the MEMS and LaMP assembly lines
Collaborate with Cisco experts on yield and performance improvement programs and structure supplier improvement projects to achieve these goals
Problem‑solve critical technical issues during LaMP production, NPI, and early production yield ramp phases
Drive continuous improvement planning and implementation including validation
Manage technical aspects of the change‑control process with suppliers and internal stakeholders
Ensure learnings are documented in relevant engineering documentation and institutional knowledge is expanded across Cisco teams
Minimum Qualifications
Bachelor’s degree + 12 years of related experience, or Master’s degree + 8 years of related experience, or PhD + 5 years of related experience.
Preferred experience in MEMS fabrication, semiconductor manufacturing, optical packaging and fiber optic components, or electronic assembly and packaging.
Position requires U.S./Canada work authorization. Cisco is an equal opportunity employer.
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Cisco has developed a unique high‑volume laser micro‑package platform (LaMP) with MEMS‑wafer fabrication at a Cisco supplier, specialized assembly and test conducted at in‑house tools and processes that provide a unique opportunity for improvements spanning from design to volume production.
This multi‑disciplinary position requires an in‑depth understanding of MEMS fabrication techniques (bulk micro‑machining) as well as more specialized methods for assembly and test of packaged optical components. The ideal candidate will have MEMS production experience for photonic or sensor applications, familiarity with general semiconductor wafer processing processes and tools, and be proficient with advanced data analysis techniques.
Candidates are expected to work closely with Cisco’s suppliers as well as Cisco’s packaging and test teams to maintain and improve yields, performance, and reliability of critical photonics components by applying structured problem‑solving techniques and leveraging advanced data collection methods.
Your Impact
In‑depth monitoring of MEMS supplier production performance and quality
Support suppliers in setting up adequate production monitoring, quality control, problem‑solving, and continuous improvement practices
Conduct failure analysis and physical characterization to root cause process and device failure modes
Lead teams in resolving yield and defectivity issues in the MEMS and LaMP assembly lines
Collaborate with Cisco experts on yield and performance improvement programs and structure supplier improvement projects to achieve these goals
Problem‑solve critical technical issues during LaMP production, NPI, and early production yield ramp phases
Drive continuous improvement planning and implementation including validation
Manage technical aspects of the change‑control process with suppliers and internal stakeholders
Ensure learnings are documented in relevant engineering documentation and institutional knowledge is expanded across Cisco teams
Minimum Qualifications
Bachelor’s degree + 12 years of related experience, or Master’s degree + 8 years of related experience, or PhD + 5 years of related experience.
Preferred experience in MEMS fabrication, semiconductor manufacturing, optical packaging and fiber optic components, or electronic assembly and packaging.
Position requires U.S./Canada work authorization. Cisco is an equal opportunity employer.
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