Director, NPI Packaging & RF Assembly Engineering

A leading semiconductor firm in San Diego seeks a Technical Director for NPI Packaging Technology and Assembly Engineering. In this role, you will lead a team to develop and implement packaging and assembly processes, collaborate with design teams, and manage product rollout. The ideal candidate has extensive experience in semiconductor packaging, strong leadership skills, and expertise with package design tools. This position offers a competitive salary and the opportunity to contribute to cutting-edge technology in the electronics industry. #J-18808-Ljbffr