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Job Summary:
TE Connectivity is a company focused on creating a safer, sustainable, and more connected world. They are seeking a Principal System Architect to lead technical engagement with customers, define high-level system architecture requirements, and drive the company's technology vision and strategy in the data communications space.
Responsibilities:
• Serve as the primary technical liaison for TE’s customers, actively engaging with hyperscalers, OEMs, and system architects to gain deep insights into next-generation compute, AI, storage, and networking challenges.
• Proactively identify and assess technology disruptors, translating emerging trends into strategic R&D initiatives and product development roadmaps to maintain TE’s industry leadership.
• Cultivate and strengthen customer partnerships, fostering co-development opportunities and collaborative innovation to accelerate next-gen infrastructure advancements.
• Drive thought leadership by educating and influencing internal and external stakeholders, from executives and product teams to key decision-makers in customer organizations, on emerging industry trends, TE’s technical capabilities, and high-value engineering solutions.
• Bridge the gap between customer needs and TE’s technology roadmap, ensuring TE delivers future-proof, scalable, and high-performance interconnect solutions tailored to the evolving data infrastructure landscape.
• Define high-level system architecture requirements, ensuring TE’s product roadmap is aligned with next-generation compute, AI, and networking ecosystems.
• Drive TE’s technology vision and strategy, ensuring our interconnect solutions support the evolving needs of standards like PCIe, CXL, Ethernet, InfiniBand, and the next-gen AI workloads.
• Lead the evaluation of high-speed electrical, optical, and hybrid interconnect solutions, balancing performance, power, latency, cost, and manufacturability.
• Collaborate with internal R&D, product development, and business units to shape product development roadmaps based on real-world customer challenges and market trends.
• Drive technical due diligence for potential partnerships, acquisitions, and ecosystem collaborations, ensuring TE stays at the forefront of innovation.
• Actively participate in and influence key industry standards groups (e.g., OCP, PCI-SIG, IEEE, Ethernet Alliance, CXL Consortium), ensuring TE’s strategic alignment with the future of data communication.
• Lead and influence discussions on emerging protocols and interface standards, ensuring TE is at the forefront of next-generation high-speed, low-latency interconnect technologies.
• Champion TE’s technical leadership by actively contributing to the development of next-gen copper and optical interconnect standards, positioning TE as an industry innovator, ensuring our solutions stay ahead of the competition.
• Represent TE at industry forums, conferences, and standards organizations, reinforcing our role as a leader in high-speed interconnect technology and ensuring our strategic perspectives drive industry advancements.
• Develop and present thought leadership content, including technical whitepapers, reference designs, keynote presentations, and industry presentations, to amplify TE’s influence within the standards community and the broader industry ecosystem.
• Work cross-functionally with engineering, product management, sales, and marketing teams to translate technical insights into compelling product offerings.
• Drive the execution of high-impact, innovative technical projects, ensuring seamless alignment between customer needs, business goals, and engineering capabilities.
• Guide TE’s go-to-market strategy for new interconnect solutions, ensuring that our technical differentiation is clearly communicated and leveraged in competitive landscapes.
Qualifications:
Required:
• Bachelor’s degree in Electrical Engineering.
• Generally requires 12 years of relevant electrical engineering work experience.
• 5+ years of experience in the system-level design in the datacenter, compute, networking or storage industry.
• In-depth knowledge of hardware and associated signaling environments.
• Technical expertise in high-speed engineering and design.
• Deep knowledge of compute, networking, AI / ML, or storage architecture.
• Expertise with industry-standard design tools (e.g., simulation, modeling, CAD, or signal integrity analysis).
• The geographically dispersed group requires that the candidate be self-motivating with the ability to take the initiative to accomplish tasks with limited direction.
• Ability to clearly communicate technical concepts to diverse audiences.
• Effectively able to build relationships with external customers and industry leaders as well as internally across all levels, disciplines, and geographies.
• Ability to spend 25%-30% of your time traveling.
Preferred:
• Having a dual bachelor’s degree in business or an MBA is a plus.
Company:
TE Connectivity provides and markets engineered electronic components, network solutions, and specialty products. Founded in 1941, the company is headquartered in Schaffhausen, Schaffhausen, CHE, with a team of 10001+ employees. The company is currently Public Company. TE Connectivity has a track record of offering H1B sponsorships.
Seniority level
Seniority level
Director
Employment type
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Full-time
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Job function
Project ManagementIndustries
Software Development
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