NextZen AI
Co-Founder / Chief Technology Officer (Advanced Packaging & Test / OSAT+) - Equi
NextZen AI, Santa Clara, California, us, 95053
Co-Founder / Chief Technology Officer (Advanced Packaging & Test / OSAT+) - Equity only in the beginning -> Salary after funding
2 days ago Be among the first 25 applicants
Title:
Co-Founder / Chief Technology Officer – Advanced Packaging and Test (Outsourced Semiconductor Assembly and Test for Artificial Intelligence)
Location note:
Primary hub:
Santa Clara, California (Hybrid)
Also very open to candidates currently in the
Folsom / Sacramento area
and the
Phoenix / Chandler / Tempe, Arizona region .
I am building
NextZen Forge
– a new kind of advanced packaging and test platform (Outsourced Semiconductor Assembly and Test, also known as OSAT) focused on the bottleneck of the artificial intelligence hardware world:
Seventy‑two‑hour Failure Analysis (FA)
for
Graphics Processing Unit (GPU)
and
High Bandwidth Memory (HBM)
modules
Time‑boxed New Product Introduction (NPI) pilot attach
windows
Auditable, data‑transparent quality
that hyperscalers and artificial intelligence chip startups actually trust
We will start with a
Failure Analysis and pilot New Product Introduction lab in Folsom / Sacramento , then scale attach and test capacity in
Arizona , and later add a
support hub in another location (if needed)
I am looking for a
Co-Founder / Chief Technology Officer
with deep experience in advanced packaging who wants to help architect this from day zero.
You will own
Designing and qualifying attach, underfill, reflow, clean, inspection, and reliability flows for Graphics Processing Unit / High Bandwidth Memory, flip‑chip ball grid array, and two‑and‑a‑half‑dimensional / three‑dimensional assemblies
New Product Introduction through to ramp: designing Design of Experiments, running first‑article and qualification lots, driving Statistical Process Control, and owning yield and Overall Equipment Effectiveness targets
Tool and facility decisions for the Folsom / Sacramento Failure Analysis lab and the first Arizona attach and test line (Mechanical, Electrical, and Plumbing loads, layouts, and vendor selection)
Technical customer interface with artificial intelligence chip companies, hyperscalers, memory vendors, and original equipment manufacturers
Building and mentoring the first engineering team (New Product Introduction, reliability, Failure Analysis technicians, quality)
You might be a fit if
You have
10–20+ years
in advanced semiconductor packaging, module engineering, or Failure Analysis at an Outsourced Semiconductor Assembly and Test provider or device maker
You have personally taken High Bandwidth Memory, interposer, chiplet, or flip‑chip packages from New Product Introduction into volume production
You are comfortable specifying and qualifying C‑Mode Scanning Acoustic Microscopy, Automated X‑ray Inspection, underfill and attach tools, and you know how to read yield and defect paretos in your sleep
You want to be a
true co‑founder , not just an employee
Compensation (founder‑level)
Equity only at the beginning:
Based on experience and commitment
After the first external funding round: salary in the range of
240,000–300,000 United States Dollars , plus bonus and benefits
Hybrid between
Santa Clara
and
Folsom / Sacramento , with some travel to
Arizona
as the attach and test line ramps
About me
I am
Santanu , Founder and Chief Executive Officer of
NextZen.ai
and
NextZen Security LLC . My background is in cybersecurity, trust, and systems. I am combining that with your deep packaging experience to build an advanced packaging platform designed for
speed, transparency, and security
from day one.
How to reach me
Message me here on LinkedIn, or
Three bullet points describing ramps you have led
A short outline of your ideal eight‑week pilot attach program
Your top five “must‑have” tools for a Graphics Processing Unit / High Bandwidth Memory attach line
If this sounds like the challenge you have been waiting for, I would love to talk.
Seniority Level
Executive
Employment Type
Full‑time
Job Function
Business Development and Sales
Industries
Information Services
Referrals increase your chances of interviewing at NextZen AI by 2x
#J-18808-Ljbffr
Title:
Co-Founder / Chief Technology Officer – Advanced Packaging and Test (Outsourced Semiconductor Assembly and Test for Artificial Intelligence)
Location note:
Primary hub:
Santa Clara, California (Hybrid)
Also very open to candidates currently in the
Folsom / Sacramento area
and the
Phoenix / Chandler / Tempe, Arizona region .
I am building
NextZen Forge
– a new kind of advanced packaging and test platform (Outsourced Semiconductor Assembly and Test, also known as OSAT) focused on the bottleneck of the artificial intelligence hardware world:
Seventy‑two‑hour Failure Analysis (FA)
for
Graphics Processing Unit (GPU)
and
High Bandwidth Memory (HBM)
modules
Time‑boxed New Product Introduction (NPI) pilot attach
windows
Auditable, data‑transparent quality
that hyperscalers and artificial intelligence chip startups actually trust
We will start with a
Failure Analysis and pilot New Product Introduction lab in Folsom / Sacramento , then scale attach and test capacity in
Arizona , and later add a
support hub in another location (if needed)
I am looking for a
Co-Founder / Chief Technology Officer
with deep experience in advanced packaging who wants to help architect this from day zero.
You will own
Designing and qualifying attach, underfill, reflow, clean, inspection, and reliability flows for Graphics Processing Unit / High Bandwidth Memory, flip‑chip ball grid array, and two‑and‑a‑half‑dimensional / three‑dimensional assemblies
New Product Introduction through to ramp: designing Design of Experiments, running first‑article and qualification lots, driving Statistical Process Control, and owning yield and Overall Equipment Effectiveness targets
Tool and facility decisions for the Folsom / Sacramento Failure Analysis lab and the first Arizona attach and test line (Mechanical, Electrical, and Plumbing loads, layouts, and vendor selection)
Technical customer interface with artificial intelligence chip companies, hyperscalers, memory vendors, and original equipment manufacturers
Building and mentoring the first engineering team (New Product Introduction, reliability, Failure Analysis technicians, quality)
You might be a fit if
You have
10–20+ years
in advanced semiconductor packaging, module engineering, or Failure Analysis at an Outsourced Semiconductor Assembly and Test provider or device maker
You have personally taken High Bandwidth Memory, interposer, chiplet, or flip‑chip packages from New Product Introduction into volume production
You are comfortable specifying and qualifying C‑Mode Scanning Acoustic Microscopy, Automated X‑ray Inspection, underfill and attach tools, and you know how to read yield and defect paretos in your sleep
You want to be a
true co‑founder , not just an employee
Compensation (founder‑level)
Equity only at the beginning:
Based on experience and commitment
After the first external funding round: salary in the range of
240,000–300,000 United States Dollars , plus bonus and benefits
Hybrid between
Santa Clara
and
Folsom / Sacramento , with some travel to
Arizona
as the attach and test line ramps
About me
I am
Santanu , Founder and Chief Executive Officer of
NextZen.ai
and
NextZen Security LLC . My background is in cybersecurity, trust, and systems. I am combining that with your deep packaging experience to build an advanced packaging platform designed for
speed, transparency, and security
from day one.
How to reach me
Message me here on LinkedIn, or
Three bullet points describing ramps you have led
A short outline of your ideal eight‑week pilot attach program
Your top five “must‑have” tools for a Graphics Processing Unit / High Bandwidth Memory attach line
If this sounds like the challenge you have been waiting for, I would love to talk.
Seniority Level
Executive
Employment Type
Full‑time
Job Function
Business Development and Sales
Industries
Information Services
Referrals increase your chances of interviewing at NextZen AI by 2x
#J-18808-Ljbffr