Principal Hardware Engineer — TMR & Wafer Process Lead

A technology company located in California is seeking a qualified individual for TMR sensor film deposition. The candidate should have 1 to 4 years of experience in PVD thin film deposition and characterization. Responsibilities include analyzing wafer processing results, performing root cause analysis for production yield issues, and transferring new deposition processes into production. An advanced degree in a related field and expertise in statistical data analysis are preferred. #J-18808-Ljbffr