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Cisco

Photonic Packaging Engineer

Cisco, Carlsbad, California, United States, 92002

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Photonic Packaging Engineer

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The application window will close on 1/30/2026. This onsite role requires working out of our Carlsbad, CA office.

Meet the Team As a Photonic Packaging Engineer, you will play a key role in developing and supporting the next generation packaging platform for Cisco's Silicon Photonics Integrated Circuits and chipsets. You’ll work as a member of the platform development team responsible for creating critical optical components, processes, and tools.

Your Impact Design, Develop and Support

Provide engineering support for Cisco’s internally developed photonic assembly packaging tools.

Gather and analyze data from Cisco’s automated packaging tools/processes to shape new projects targeting improvement in novel subassemblies used in Cisco-designed high-volume manufacturing platforms.

Recommend and implement test/assembly/process improvements, including cycle time reduction and automation to minimize required operator time and intervention.

Design, build, and test prototypes of critical, complex electromechanical assemblies to be used in automated manufacturing/test tools.

Diagnostics Development & Lifecycle Management

Follow new tools, processes, and components from development to production to ensure successful integration of new platform technologies.

Apply analytics and AI/ML to stimulate edge cases, optimize strategies, improve coverage, usability, debug capabilities and problem detection using structured problem‑solving methodologies.

Collaboration & Team Development

Partner with hardware, software, and manufacturing teams to ensure multi‑functional alignment and successful transition to manufacturing.

Develop and execute project plans with predictability, quality, and velocity.

Collaborate and travel to assure successful product deployment across a global environment.

Mentor and develop high‑performing teams, emphasizing continuous learning in diagnostics, data engineering, advanced analytics, and effective use of AI‑assisted development tools.

Minimum Qualifications

Bachelor’s + 7 years of related experience, or Master’s + 4 years, or PhD + 1 year.

Hardware/process automation experience.

Preferred Qualifications

Experience in hardware/software automation of photonics assembly/test.

Experience with machine vision in an automation environment.

Data analysis (SQL/JMP) in a semiconductor production environment.

Software development using C# on .NET.

Knowledge of photonics, fiber optics and semiconductor lasers.

Compensation and Benefits Starting salary range: $134,300.00 to $195,400.00 (U.S./Canada).

Additional benefits include medical, dental, vision, 401(k) with matching, paid parental leave, disability coverage, life insurance, and Cisco stock units.

U.S. employees are eligible for paid time off: 10 paid holidays, 1 floating holiday, birthday day off, and 4 wellness days; 16 days of paid vacation (non‑exempt); flexible vacation for exempt employees; 80 hours of sick time per year, among others.

Seniority Level Mid‑Senior level

Employment Type Full‑time

Job Function Engineering and Information Technology, Software Development

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