Celestica
Senior Principal, Design Engineering - Thermal
Celestica, Merrimack, New Hampshire, us, 03054
Senior Principal, Design Engineering - Thermal
2 weeks ago – Be among the first 25 applicants
Req ID: 130887
Region: Americas
Country: USA
Summary Join a world class team to create high end electronics cooling solutions for systems such as AI servers, switches, accelerators, and their racks. We work hard together to design at the leading edge of cooling technology. Celestica has a profoundly cooperative and nonconfrontational culture.
Responsibilities
Lead thermal strategy and new technology investigation.
Leverage your deep experience in data center electronics to immediately address customer thermal needs.
Define Celestica's future direction and capabilities for thermal systems in the intermediate and long term.
Develop the strategy for Celestica thermal solutions from the chip to rack level.
With others define data center installations including in-row CDUs.
Apply the best technologies to meet customer needs of performance and reliability at the lowest cost.
Advise on test and evaluation methods for high performance cooling systems.
Evaluate suppliers and their technology.
Extend single phase chip cooling as far as is practical, and apply to customer designs.
Consider existing and future direction in CDUs.
Investigate and determine 2-phase thermal strategy and lead a smooth transition to this technology when required.
Consider true direct liquid cooling of a chip, where the liquid wets the silicon, including the comparison of different fin patterns etched into the chip.
Determine the limits of single phase in this application and define the considerations for 2-phase.
Knowledge, Skills, and Competencies
Data center system cooling
Supply chain interaction
Heat transfer theory and its application to electronics cooling
Systems design understanding of the entire heat path: chip to rejection to the environment.
Leading peers and more junior engineers
Typical Experience
Thermal system architect
Customer facing
Participation in intercompany groups and consortiums for system, technology, or standards development
Typical Education
Master's degree in Mechanical Engineering with focus on heat transfer
Annual Salary $177,000 - $277,000
Notes This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.
Equal Opportunity Employment All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.
Celestica's policy on equal employment opportunity prohibits discrimination based on race, color, creed, religion, national origin, gender, sexual orientation, gender identity, age, marital status, veteran or disability status, or other characteristics protected by law. This policy applies to hiring, promotion, discharge, pay, fringe benefits, job training, classification, referral and other aspects of employment and also states that retaliation against a person who files a charge of discrimination, participates in a discrimination proceeding, or otherwise opposes an unlawful employment practice will not be tolerated. All information will be kept confidential according to EEO guidelines.
Company Overview Celestica (NYSE, TSX: CLS) enables the world's best brands. Through our recognized customer‑centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development – from drawing board to full‑scale production and after‑market services for products from advanced medical devices, to highly engineered aviation systems, to next‑generation hardware platform solutions for the Cloud. Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers.
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Req ID: 130887
Region: Americas
Country: USA
Summary Join a world class team to create high end electronics cooling solutions for systems such as AI servers, switches, accelerators, and their racks. We work hard together to design at the leading edge of cooling technology. Celestica has a profoundly cooperative and nonconfrontational culture.
Responsibilities
Lead thermal strategy and new technology investigation.
Leverage your deep experience in data center electronics to immediately address customer thermal needs.
Define Celestica's future direction and capabilities for thermal systems in the intermediate and long term.
Develop the strategy for Celestica thermal solutions from the chip to rack level.
With others define data center installations including in-row CDUs.
Apply the best technologies to meet customer needs of performance and reliability at the lowest cost.
Advise on test and evaluation methods for high performance cooling systems.
Evaluate suppliers and their technology.
Extend single phase chip cooling as far as is practical, and apply to customer designs.
Consider existing and future direction in CDUs.
Investigate and determine 2-phase thermal strategy and lead a smooth transition to this technology when required.
Consider true direct liquid cooling of a chip, where the liquid wets the silicon, including the comparison of different fin patterns etched into the chip.
Determine the limits of single phase in this application and define the considerations for 2-phase.
Knowledge, Skills, and Competencies
Data center system cooling
Supply chain interaction
Heat transfer theory and its application to electronics cooling
Systems design understanding of the entire heat path: chip to rejection to the environment.
Leading peers and more junior engineers
Typical Experience
Thermal system architect
Customer facing
Participation in intercompany groups and consortiums for system, technology, or standards development
Typical Education
Master's degree in Mechanical Engineering with focus on heat transfer
Annual Salary $177,000 - $277,000
Notes This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.
Equal Opportunity Employment All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.
Celestica's policy on equal employment opportunity prohibits discrimination based on race, color, creed, religion, national origin, gender, sexual orientation, gender identity, age, marital status, veteran or disability status, or other characteristics protected by law. This policy applies to hiring, promotion, discharge, pay, fringe benefits, job training, classification, referral and other aspects of employment and also states that retaliation against a person who files a charge of discrimination, participates in a discrimination proceeding, or otherwise opposes an unlawful employment practice will not be tolerated. All information will be kept confidential according to EEO guidelines.
Company Overview Celestica (NYSE, TSX: CLS) enables the world's best brands. Through our recognized customer‑centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development – from drawing board to full‑scale production and after‑market services for products from advanced medical devices, to highly engineered aviation systems, to next‑generation hardware platform solutions for the Cloud. Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers.
#J-18808-Ljbffr