Senior Substrate & 3DIC Packaging Engineer

A leading semiconductor foundry in San Jose seeks a highly skilled Substrate / Advanced Package Engineer to innovate in 3DIC design and packaging. Responsibilities include designing, simulating, and optimizing advanced packaging technologies while collaborating with cross-functional teams. Candidates should have a Master’s degree or Ph.D. in Engineering and over 15 years of relevant experience. The role promises significant impact within a cutting-edge environment focused on technological advancements. #J-18808-Ljbffr