Headway Technologies
Thin Film Manufacturing Engineer
Headway Technologies, Milpitas, California, United States, 95035
REPORTS TO:
SR. MANAGER, THIN FILM MANUFACTURING ENGINEERING
SUMMARY Under the direction of the Sr. Manager of Thin Film Manufacturing Engineering, the Thin Film Manufacturing Engineer is responsible for monitoring, sustaining, and supporting day-to-day thin film manufacturing processes, providing technical support to ensure process reliability, verifying process robustness through experimentation, improving deposition and/or dry etching efficiency, developing and implementing cost‑reducing practices, conducting root cause analysis, and improving production yields via process and tool optimization. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS
Monitors, sustains, and supports day‑to‑day thin film manufacturing processes, programs, and activities.
Ensures process reliability by providing technical support to operators, technicians, and other engineers.
Improves the efficiency of deposition and/or dry etching processes by analyzing data, conducting experiments, and researching alternative methods to reduce scrap.
Designs and conducts experiments to verify process robustness through characterization of process latitudes.
Develops and implements practices or methodologies that lower cost, reduce cycle time, and improve operational efficiency.
Conducts root cause analysis and implements corrective action when required.
Responds to inquiries from other team members, managers, or departments.
Uses Statistical Process Control (SPC) to analyze product quality data; develops charts or reports and presents findings to groups or teams.
Adheres to all safety policies and procedures as required.
Performs other duties of a similar nature or level.
MINIMUM QUALIFICATIONS
Master’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, Physics, or equivalent relevant experience; PhD preferred.
Three years of hands‑on experience in magnetic thin film fabrication or semiconductor industry manufacturing or process engineering.
Hands‑on experience with SPC and Design of Experiments (DOE).
Proficient in Microsoft Office applications.
KNOWLEDGE, SKILLS, AND ABILITIES
Strong knowledge of magnetic thin film fabrication techniques using deposition and ion milling technologies.
Knowledge and experience with TMR, CPP GMR, and spin‑transfer oscillator film processes.
Knowledge of surface analytical/materials characterization techniques, including XRD, AFM, TEM, SEM, and FIB.
Knowledge and experience of process development and integration.
Knowledge and proficiency with JMP or Excel and ability to create macro formulas.
Ability to create spreadsheets, Word documents, and presentations using Microsoft Office.
Design experiments, analyze results, and recommend corrective action.
Effective verbal and written communication with all levels of contractors, employees, and management.
Collaborative work with employees and management at all levels.
Compliance with all safety policies and procedures.
Critical thinking to resolve issues, perform root cause analysis, and recommend process improvements.
Demonstrated critical thinking and analytical skills.
Demonstrated organizational and time‑management skills.
Demonstrated problem‑solving and troubleshooting skills.
Flexibility and ability to prioritize.
The annual base salary for this full‑time position is between $120,819.00‑$177,675.00, plus bonus target and benefits. The base pay may vary based on job responsibilities, related knowledge, skills, abilities, education, and experience. This range is subject to change and may be modified periodically.
WORKING CONDITIONS The Thin Film Manufacturing Engineer works primarily in an office environment Monday through Friday. The schedule may change to meet business or operational needs and may require occasional travel between buildings. Work is performed in a Class 100 ESD‑sensitive wafer manufacturing facility, wearing a cleanroom suit (hood, gloves, safety glasses, booties, mask). Potential exposure to hazardous chemicals, fumes, gases, and loud noise, with requirements to stand, walk, bend, twist, perform fine grasping, and occasionally lift up to 30 pounds.
BENEFITS
Medical insurance
Vision insurance
401(k)
Tuition assistance
Disability insurance
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation should contact the Headway Human Resources Department.
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SR. MANAGER, THIN FILM MANUFACTURING ENGINEERING
SUMMARY Under the direction of the Sr. Manager of Thin Film Manufacturing Engineering, the Thin Film Manufacturing Engineer is responsible for monitoring, sustaining, and supporting day-to-day thin film manufacturing processes, providing technical support to ensure process reliability, verifying process robustness through experimentation, improving deposition and/or dry etching efficiency, developing and implementing cost‑reducing practices, conducting root cause analysis, and improving production yields via process and tool optimization. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS
Monitors, sustains, and supports day‑to‑day thin film manufacturing processes, programs, and activities.
Ensures process reliability by providing technical support to operators, technicians, and other engineers.
Improves the efficiency of deposition and/or dry etching processes by analyzing data, conducting experiments, and researching alternative methods to reduce scrap.
Designs and conducts experiments to verify process robustness through characterization of process latitudes.
Develops and implements practices or methodologies that lower cost, reduce cycle time, and improve operational efficiency.
Conducts root cause analysis and implements corrective action when required.
Responds to inquiries from other team members, managers, or departments.
Uses Statistical Process Control (SPC) to analyze product quality data; develops charts or reports and presents findings to groups or teams.
Adheres to all safety policies and procedures as required.
Performs other duties of a similar nature or level.
MINIMUM QUALIFICATIONS
Master’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, Physics, or equivalent relevant experience; PhD preferred.
Three years of hands‑on experience in magnetic thin film fabrication or semiconductor industry manufacturing or process engineering.
Hands‑on experience with SPC and Design of Experiments (DOE).
Proficient in Microsoft Office applications.
KNOWLEDGE, SKILLS, AND ABILITIES
Strong knowledge of magnetic thin film fabrication techniques using deposition and ion milling technologies.
Knowledge and experience with TMR, CPP GMR, and spin‑transfer oscillator film processes.
Knowledge of surface analytical/materials characterization techniques, including XRD, AFM, TEM, SEM, and FIB.
Knowledge and experience of process development and integration.
Knowledge and proficiency with JMP or Excel and ability to create macro formulas.
Ability to create spreadsheets, Word documents, and presentations using Microsoft Office.
Design experiments, analyze results, and recommend corrective action.
Effective verbal and written communication with all levels of contractors, employees, and management.
Collaborative work with employees and management at all levels.
Compliance with all safety policies and procedures.
Critical thinking to resolve issues, perform root cause analysis, and recommend process improvements.
Demonstrated critical thinking and analytical skills.
Demonstrated organizational and time‑management skills.
Demonstrated problem‑solving and troubleshooting skills.
Flexibility and ability to prioritize.
The annual base salary for this full‑time position is between $120,819.00‑$177,675.00, plus bonus target and benefits. The base pay may vary based on job responsibilities, related knowledge, skills, abilities, education, and experience. This range is subject to change and may be modified periodically.
WORKING CONDITIONS The Thin Film Manufacturing Engineer works primarily in an office environment Monday through Friday. The schedule may change to meet business or operational needs and may require occasional travel between buildings. Work is performed in a Class 100 ESD‑sensitive wafer manufacturing facility, wearing a cleanroom suit (hood, gloves, safety glasses, booties, mask). Potential exposure to hazardous chemicals, fumes, gases, and loud noise, with requirements to stand, walk, bend, twist, perform fine grasping, and occasionally lift up to 30 pounds.
BENEFITS
Medical insurance
Vision insurance
401(k)
Tuition assistance
Disability insurance
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation should contact the Headway Human Resources Department.
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