Intel
A leading semiconductor company in Phoenix, Arizona, is seeking an experienced Advanced IC Packaging Software Engineer to work with Intel foundry customers. This role focuses on advanced packaging technologies, design tool implementation, and requires strong skills in C/C++, algorithms, and EDA tools. Ideal candidates will hold a Bachelor's or Master's degree in Computer Science or Electrical Engineering and have relevant experience. The position offers a hybrid work model and a competitive compensation package including salary ranging from $109,070 to $206,860 annually.
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