Packaging Module Equipment Engineer - Innovation & Scale

A leading technology company in Phoenix, Arizona, seeks a Packaging Module Equipment Development Engineer. This role involves developing equipment for integration readiness of various product architectures, enhancing manufacturing efficiency, and ensuring product quality for semiconductor packaging. The candidate should have a degree in Engineering, Physics, or Chemistry and significant industry experience. The position offers a competitive salary range of $110,880.00-$216,140.00 and requires onsite presence. #J-18808-Ljbffr