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Intel Corporation

Packaging Module Equipment Engineer - Innovation & Scale

Intel Corporation, Phoenix, Arizona, United States, 85003

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A global technology leader is seeking a Packaging Module Equipment Development Engineer in Phoenix, Arizona. The role involves developing and optimizing semiconductor packaging equipment to enhance manufacturing processes. Candidates must have a strong educational background in Engineering, Physics, or Chemistry, along with significant industry experience. Key responsibilities include improving process efficiencies, managing vendor performance, and ensuring product quality. This position requires on-site presence to collaborate effectively with teams and meet operational goals. #J-18808-Ljbffr