3D IC Design Enablement Engineer – Tapeout & PDK

A leading semiconductor company is seeking a highly motivated engineer to focus on 3D design PDK development and EDA user support for advanced semiconductor design flows. In this role, the engineer will collaborate closely with internal design teams and external partners to ensure smooth tape out processes. Candidates should have a degree in Engineering and relevant ASIC experience. This position offers opportunities for innovation in a fast-paced environment. #J-18808-Ljbffr