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Intel Corporation

Semiconductor Packaging Design Engineer — Vision & ML

Intel Corporation, Phoenix, Arizona, United States, 85003

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A leading semiconductor company in Phoenix is seeking a Packaging Module Development Engineer to focus on machine vision and machine learning in semiconductor packaging. Candidates should hold a degree in engineering or related fields and ideally possess knowledge of optics and experience with Python and OpenCV. The role involves conducting material tests, managing projects, and defining package specifications. This position offers competitive compensation and requires on-site presence. #J-18808-Ljbffr