Senior Photonic Packaging Integration Engineer (2.5D/3D)

A leading semiconductor foundry company is seeking an MTS Packaging Integration Engineer in New York. This role focuses on delivering advanced packaging integration for electro-optical transceivers, ensuring product reliability, and guiding design through to production. Ideal candidates will possess an MS or PhD and extensive experience in failure analysis and process integration. The salary range is competitive, reflecting the expertise required for this role. #J-18808-Ljbffr