Qorvo, Inc.
Senior Principal RF Module Design Engineer
Qorvo, Inc., Richardson, Texas, United States, 75080
Senior Principal RF Module Design Engineer
Experience Level: Professional
Job Type: Regular
Location: Richardson, TX, US, 75081
Requisition ID: 9823
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.
Our systems, technology and research (ST&R) advanced development organization is looking for innovative and experienced Senior Principal RF Microwave Multi‑chip Module Design Engineers. This individual will be responsible for the development of advanced high frequency RF/Microwave components utilizing the newest technologies. The position will involve research, architecture, design, and development of highly complex multi‑chip modules that would integrate Antennas, III‑V MMICs, and Silicon based ICs (BFICs, RFICs, PMICs) into advanced state‑of‑the‑art 3DHI packaging technologies. You will be a leading member of a research team that is chartered to develop the most complex and challenging prototypes and demonstrators for Qorvo’s aerospace and defense applications.
Responsibilities
Technical lead role for RF/mmWave multi‑chip module (MCM) based research
Integrate MMIC(s) into complex 3DHI module package solutions
Advanced package design using 2.5D and 3D electromagnetic simulators.
Laminate design and fabrication
MCM assembly and design verification testing (DVT) in the test lab.
Execute DVT analysis and present results to the internal and/or external customer.
Perform concept feasibility, architecture, and cascade analysis
Develop innovative solutions and technologies
Required Technical Qualifications and Experience
Experience in integrating microwave/millimeter‑wave MMIC dies such as amplifiers, switches, phase shifters, attenuators, BFICs, PMICs, etc. in multi‑chip modules
Expert‑level user in 3D EM simulation tools such as HFSS, Sonnet, FEKO, and/or Analyst and knowledge of one or more of the following: ADS, Microwave Office (MWO) or Cadence (Spectre) circuit simulators.
Expert in analyzing performance tradeoffs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA, etc.
Strong understanding of electromagnetic theory and RF fundamentals such as s‑parameters, impedance matching, transmission lines, design of passive structures such as couplers, etc.
Hands‑on experience in microwave measurements, characterization, and calibration methods.
Knowledge of advanced semiconductor technologies such as GaN, GaAs and/or Silicon for W‑band and D‑band frequencies
Knowledge of the thermal and integration challenges of high‑power front ends (>1W)
Broad knowledge of semiconductor RF / power packaging, materials and assembly processes supporting infrastructure and defense electronic assemblies and sub‑assemblies.
Strong written and oral communication skills with the ability to concisely summarize highly technical concepts.
Desired Experience
Knowledge of RF signal chain and system analysis is a plus.
Knowledge of antenna design is a plus.
Published author in technical journals and/or magazines.
Strong ability to meet customer technical needs and schedules.
Required Education and Experience
MS Electrical Engineering with 8 or more years of experience
PhD Electrical Engineering (with RF/Microwave focus) with 4 or more years of experience
MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
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Job Type: Regular
Location: Richardson, TX, US, 75081
Requisition ID: 9823
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.
Our systems, technology and research (ST&R) advanced development organization is looking for innovative and experienced Senior Principal RF Microwave Multi‑chip Module Design Engineers. This individual will be responsible for the development of advanced high frequency RF/Microwave components utilizing the newest technologies. The position will involve research, architecture, design, and development of highly complex multi‑chip modules that would integrate Antennas, III‑V MMICs, and Silicon based ICs (BFICs, RFICs, PMICs) into advanced state‑of‑the‑art 3DHI packaging technologies. You will be a leading member of a research team that is chartered to develop the most complex and challenging prototypes and demonstrators for Qorvo’s aerospace and defense applications.
Responsibilities
Technical lead role for RF/mmWave multi‑chip module (MCM) based research
Integrate MMIC(s) into complex 3DHI module package solutions
Advanced package design using 2.5D and 3D electromagnetic simulators.
Laminate design and fabrication
MCM assembly and design verification testing (DVT) in the test lab.
Execute DVT analysis and present results to the internal and/or external customer.
Perform concept feasibility, architecture, and cascade analysis
Develop innovative solutions and technologies
Required Technical Qualifications and Experience
Experience in integrating microwave/millimeter‑wave MMIC dies such as amplifiers, switches, phase shifters, attenuators, BFICs, PMICs, etc. in multi‑chip modules
Expert‑level user in 3D EM simulation tools such as HFSS, Sonnet, FEKO, and/or Analyst and knowledge of one or more of the following: ADS, Microwave Office (MWO) or Cadence (Spectre) circuit simulators.
Expert in analyzing performance tradeoffs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA, etc.
Strong understanding of electromagnetic theory and RF fundamentals such as s‑parameters, impedance matching, transmission lines, design of passive structures such as couplers, etc.
Hands‑on experience in microwave measurements, characterization, and calibration methods.
Knowledge of advanced semiconductor technologies such as GaN, GaAs and/or Silicon for W‑band and D‑band frequencies
Knowledge of the thermal and integration challenges of high‑power front ends (>1W)
Broad knowledge of semiconductor RF / power packaging, materials and assembly processes supporting infrastructure and defense electronic assemblies and sub‑assemblies.
Strong written and oral communication skills with the ability to concisely summarize highly technical concepts.
Desired Experience
Knowledge of RF signal chain and system analysis is a plus.
Knowledge of antenna design is a plus.
Published author in technical journals and/or magazines.
Strong ability to meet customer technical needs and schedules.
Required Education and Experience
MS Electrical Engineering with 8 or more years of experience
PhD Electrical Engineering (with RF/Microwave focus) with 4 or more years of experience
MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
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